Rogers Corporation will be highlighting its wide range of circuit materials at the 2017 IEEE International Microwave Symposium (IMS), the RF and microwave industry’s largest annual international gathering of RF and microwave engineering professionals.
IMS2017 is June 6-8 in Honolulu, Hawaii and the theme is “riding the wave” of the coming 5G wireless communications revolution. The event combines technical engineering sessions with a large exhibition area which includes representatives from leading RF and microwave industry companies. It is expected to feature more than 400 exhibition booths and attract more than 8000 attendees.
Rogers Corp. will show examples of its extensive range of circuit materials at Booth #1548, and offer guidance to visitors on the optimum use of those materials for circuits ranging from high speed and high-frequency (HF) bands through millimeter-wave frequencies.
Visitors to the Rogers’ booth will learn about a diversified group of circuit materials, including Kappa™ 438 laminates, RO1200™ laminates, RO4730G3™ laminates and 92ML™ laminates and prepregs.
Kappa 438 Laminates
Kappa 438 laminates feature the performance of mid-tier circuit materials that exceed performance limitations of FR-4 and provide the optimum blend of price, performance and durability. Kappa 438 laminates have low loss, excellent dielectric constant (Dk) tolerance and tight thickness control, and are engineered for outstanding, repeatable wireless performance. Kappa 438 laminates have a low Z axis CTE and High Tg for improved design flexibility, PTH reliability and automated assembly compatibility. They can be fabricated using standard epoxy/glass (FR-4) processes. These laminates are compatible with conventional bondplies and lead free solder processes, and have the UL 94 V-0 flame retardant rating. A design Dk of 4.38 tailored to FR-4 industry standard norms facilitates ease of converting existing FR-4 designs where better electrical performance is needed.
Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP infrastructure, high performance computing and test and measurement. RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. Rogers RO1200 circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.
With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 at10 GHz, RO1200 laminates provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE and a halogen free UL 94 V-0 rating, RO1200 laminates are well suited for the most demanding high layer count applications.
RO4730G3 UL 94 V-0 antenna grade ceramic hydrocarbon laminates combine a flame retardant, low loss thermoset dielectric with patented LoPro® copper foil and incorporate a proprietary filler system that brings to market solutions for current macro base station antenna designs on traditional and active antenna arrays and PCB antennas solutions for those about to come, such as 5G infrastructure.
RO4730G3 laminates have a Dk match to 3.0, Df of 0.0023 (measured at 2.5 GHz), low z-axis CTE of 30.3 ppm/°C from -55°C to +288°C for plated through hole reliability, low density microspheres yielding a laminate 30 percent lighter than PTFE products, excellent passive-intermodulation (PIM) performance and are compatible with conventional epoxy and high temperature lead-free solder processing. With the right combination of materials, RO4730G3 laminates offer practical, cost effective circuit material solutions.
92ML materials are halogen-free, flame retardant, thermally conductive epoxy based prepreg and laminate systems. These thermally enhanced laminates and prepregs are specifically engineered and manufactured to meet the demands of high-power applications. They provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics. These materials are ideal for multilayer applications requiring thermal management throughout the entire board. The 92ML laminate materials are available with up to four oz copper cladding; thick enough to meet today’s most demanding power distribution requirements. The high thermal conductivity of up to 3.5 W/mK (in-plane) in combination with the relative ease and familiarity of epoxy based systems makes this material an ideal candidate for applications such as motor controllers, power supplies, converters, automotive electronics, etc. The relatively high Tg value of 160°C in combination with a low Z-axis coefficient of thermal expansion of 22ppm/°C (