Rogers Advanced Connectivity Solutions manufactures quality, high performance laminates. With manufacturing locations in the United States, Belgium and China, we supply proven laminate solutions for high frequency applications in the wireless base station, defense/aerospace, automotive, high-speed digital and advanced chip packaging markets across the globe. We take pride in our innovation to meet the evolving expectations of the electronics industry.
A new 16-page Material Selection Guide for its BISCO Silicone material. These materials, which are offered in cellular, solid and specialty grades, are used in a wide range of markets, from transportation and communications to electronics and high intensity lighting. Applications include gaskets and seals, high temperature PCB thermal insulation and battery shields, automotive heat shields, and vibration and acoustic mitigation pads.Download
This brochure provides a detailed overview of Rogers comprehensive capabilities in screen-printed electronics and associated services, gained from over 20 years of design and high volume manufacturing experience in printed electronics, low power EL backlighting systems and EL driver ICs.Download