Rogers Corp., a leading supplier of high frequency materials for circuit boards in amplifiers, antennas, satellites and microwave radios, will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS) ( This event takes place June 4-6 at the Washington State Convention Center in Seattle, WA. Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.

Visitors to IMS exhibition booth #1459 will learn more about Rogers’ next generation RO4000® circuit materials, notably RO4835™ high frequency laminates. These materials are specially formulated with enhanced oxidation resistance for applications requiring outstanding electrical stability over time and temperature, while maintaining the cost advantages of standard thermoset materials. In fact, low-loss circuits on RO4835 laminates can be fabricated using standard processes used for epoxy/glass (FR-4) circuit materials.

Just as with Rogers RO4350B™ circuit materials, RO4835 laminates offer a dielectric constant of 3.48 and a low loss tangent of 0.0037 at 10 GHz, plus a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety
of processing and operating conditions. These improved oxidation resistant circuit materials exhibit x- and y-axis expansion coefficients similar to those of copper, for excellent dimensional stability. RO4835 laminates are RoHS-compliant and do not require special preparation, minimizing production costs.

Visitors can also learn about Rogers’ newest PCB material: RO4360G2™ laminates. RO4360G2 laminates, with an improved relative temperature index (RTI) for a higher UL maximum operating temperature (MOT), exhibit a dielectric constant of 6.15 at 10 GHz. These glass-reinforced, ceramic-filled thermoset laminates offer the ideal balance of performance and processing ease. They are RoHS compliant and compatible with lead-free processing methods; in fact, they can be processed with the same methods as for FR-4 to minimize production costs. RO4360G2 laminates feature low loss and low z-axis CTE, with characteristics well suited for demanding RF/microwave circuits, such as amplifiers.

As part of the IMS 2013 technical program, John Coonrod author of numerous articles on circuit materials as well as the popular “ROG” blog series ( will present at the Microwave Application Seminars (MicroApps). His presentation, “Determining Circuit Material Dielectric Constant from Phase Measurements” is scheduled at 3:30 PM Tuesday, June 4 in the MicroApps Theatre on the IMS exhibition floor. MicroApps presentations typically run about 15 to 20 minutes in length.