Rogers Corp. will be showing samples of its extensive portfolio of high performance circuit materials at this year’s 2018 IEEE MTT-S International Microwave Symposium (IMS). The IMS event is the RF/microwave industry’s largest gathering of electrical engineering professionals and features technical conferences, workshops and a vast exhibition area where visitors can see and learn more about the industry’s latest products and technologies. The full 2018 IEEE IMS event, including conference and exhibition, is set for June 10-15, 2018 at the Pennsylvania Convention Center in Philadelphia, Pa, with the exhibition scheduled for June 12-14, 2018.

Rogers, at Booth #939, will be part of this large exhibition event, presenting circuit materials from its Advanced Connectivity Solutions business unit. These materials support a wide range of applications such as vehicular thermal management and Advanced Driver Assistance Systems (ADAS) at mmWave frequencies of 24 and 76 through 81 GHz, IoT devices for connected small homes and offices, PCB antennas for communications and radar systems and backhaul radios for present and future wireless communications networks. 

RO4835T™/RO4835™ Laminates, RO4450T™ Bonding Materials & CU4000™/CU4000 LoPro® Foils

RO4835T laminates, offered in a 2.5, 3 and 4 mil core thickness, are 3.3 Dk, low loss, spread glass reinforced, ceramic filled thermoset materials designed for inner-layer use in multilayer board designs and complement RO4835™ laminates when thinner cores are needed. RO4450T Bonding Materials are 3.2 to 3.3 Dk, low loss, spread glass reinforced, ceramic filled bonding materials that were designed to complement RO4835T and the existing RO4000® laminate family, and come in 3, 4 or 5 mil thicknesses. CU4000 and CU4000 LoPro Foils are sheeted foil options for designers looking for foil lamination builds, and provide good outer layer adhesion when used with RO4000 products.

RO4835T laminates and RO4450T bonding materials exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and are compatible with standard epoxy/glass (FR-4) processes. These materials are an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4000 products are capable of withstanding multiple lamination cycles. RO4835T laminates and RO4450T bonding materials have the UL 94 V-0 flame retardant rating, and are compatible with lead-free processes.

CLTE-MW™ Laminates

CLTE-MW™ laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or electrical constraints. The seven available thickness options from 3 to 10 mils ensure that ideal signal to ground spacing exists for today’s 5G and other mmWave designs. In addition, a variety of copper foil options are available including rolled, reverse treated ED and standard ED. Resistive foil and metal plate options are also available upon request.

CLTE-MW laminates are reinforced with spread glass, which along with a high filler loading help minimize the high frequency glass weave effects on electromagnetic wave propagation. The woven glass reinforcement also provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (30ppm/°C) for excellent plated through hole reliability, a low loss tangent of 0.0015 at 10 GHz to enable low loss designs and low moisture absorption of 0.03 percent to ensure stable performance in a range of operating environments. Thermal conductivity of 0.42 W/(m.K) enables heat dissipation in aggressive designs along with a high dielectric strength of 630 V/mil to ensure good z-axis insulation between conductor layers. The UL 94 V-0 flammability rating enables the use of CLTE-MW laminates in commercial applications.

CLTE-MW laminates are well suited for a range of applications including Amplifiers, Antennas, Baluns, Couplers and Filters. Applicable markets range from Commercial and Consumer to Defense and Aerospace.

 Xtreme Speed™ RO1200™ High Speed, Extremely Low Loss Laminates

As the demand for faster and more data drives channel speeds of core network infrastructure beyond 50 Gbps, one of the limiting factors in increasing performance is the signal attenuation resulting from the circuit materials.

Network equipment designers need high performance circuit materials with superior electrical properties for applications like IP Infrastructure, High Performance Computing, and Test and Measurement. Xtreme Speed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. Rogers XtremeSpeed RO1200 circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications.

With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 at 10 GHz, RO1200 laminates provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, RO1200 laminates are well suited for the most demanding high layer count applications.

AD300D™ Antenna Grade Laminates

AD300D fourth generation, commercial microwave and RF laminate material extends the capabilities of the successful AD300™ product grade. This ceramic-filled,glass-reinforced, PTFE based material provides the controlled dielectric constant (2.94±0.05), low loss performance (0.0021 at 10 GHz), very good passive intermodulation response (-159 dBc at 0.030 in. thickness), and good circuit processability required for mobile infrastructure microstrip antenna applications.

IM Series™ Antenna Grade Laminates: 

The IM Serieshigh frequencylaminatesarean outstanding Passive Intermodulation (PIM) performing version of their AD300D, AD255C™, and DiClad® 880 antenna grade laminates. The PIM performance of all substrates with the IM cladding has typical values of -166 dBc at 0.030 in. and -165 dBc at -060 in. using the Rogers internal test method of two 43 dBm swept tones at 1900 MHz.

Visitors to the 2018 IMS exhibition floor can learn more about these and other materials for electronic design at Rogers’ Booth #939. Designers of high-power systems, such as communications radio transmitters and radar systems, for example, can find out about materials with high thermal conductivity for use in thermal management applications, whether in digital, power or microwave circuits. 

Rogers’ John Coonrod to Deliver Two Presentations at IMS

As part of the MicroApps program, Rogers’ Technical Marketing Manager John Coonrod will make two presentations:

  • Tues., June 12 at 1:45 – “Material and Circuit Influences for PIM-Related Issues”
  • Thurs., June 14 at 11:00 – “The Impact of PTH Via’s on PCB RF Performance”