Rogers Corp. will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition.

The Satellite 2013 Exhibition ( will take place on March 19-21 at the Walter E. Washington Convention Center, Washington, DC. More than 350 companies will be exhibiting at this major satcom event, including more than 45 first-time exhibitors. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #4122 to answer questions and provide insight into the optimum use of the Company’s high performance circuit board materials, including RT/duroid® 6035HTC high-frequency laminates, light-weight RT/duroid 5880LZ circuit materials, and 2929 bondply material for fabricating multilayer circuits.

RT/duroid 6035HTC is a ceramic-filled, polytetrafluoroethylene (PTFE) composite material designed especially for high frequency, high power applications, such as antenna beam forming networks and power amplifiers for satcom systems and wireless cellular communications networks. With a relative dielectric constant of 3.50 at 10 GHz, the circuit material achieves minimal dielectric loss by merit of a low dissipation factor of 0.0013 at 10 GHz. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system that enables excellent thermal conductivity of 1.44 W/m/K, with low drill wear compared to competitive offerings.

Rogers RT/duroid 5880LZ PTFE based composite also features a unique filler, resulting in a low-density, light weight material well suited for airborne and satellite communications antennas, point-to-point digital radio antennas, and light weight feed networks. RT/duroid 5880LZ circuit materials combine a low relative dielectric constant of 1.96 and low dissipation factor of typically 0.0019, both in the z-axis at 10 GHz, for usable performance to Ku-band frequencies and beyond. These laminates can be easily cut, sheared, and machined and boast a low density of 1.4 g/cm3.

Rogers 2929 bondply is an unreinforced thermoset resin-based thin film adhesive system ideal for constructing reliable, multilayer circuits. It has a low dielectric constant of 2.94 in the z-axis at 10 GHz, with a low loss tangent of less than 0.003 also in the z-axis at 10 GHz. Well-suited for creating multilayer circuit boards with many of Rogers’ high-performance composite dielectric materials, including Rogers RT/duroid 6000, RO4000®, and RO3000® Series laminates, 2929 bondply materials are based on a proprietary cross-linking resin system that makes the adhesive system compatible with sequential bond processing techniques.