Rogers Corp. will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition.
The Satellite 2013 Exhibition (www.satellite2013.com) will take place on March 19-21 at the Walter E. Washington Convention Center, Washington, DC. More than 350 companies will be exhibiting at this major satcom event, including more than 45 first-time exhibitors. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #4122 to answer questions and provide insight into the optimum use of the Company’s high performance circuit board materials, including RT/duroid® 6035HTC high-frequency laminates, light-weight RT/duroid 5880LZ circuit materials, and 2929 bondply material for fabricating multilayer circuits.
RT/duroid 6035HTC is a ceramic-filled, polytetrafluoroethylene (PTFE) composite material designed especially for high frequency, high power applications, such as antenna beam forming networks and power amplifiers for satcom systems and wireless cellular communications networks. With a relative dielectric constant of 3.50 at 10 GHz, the circuit material achieves minimal dielectric loss by merit of a low dissipation factor of 0.0013 at 10 GHz. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system that enables excellent thermal conductivity of 1.44 W/m/K, with low drill wear compared to competitive offerings.
Rogers RT/duroid 5880LZ PTFE based composite also features a unique filler, resulting in a low-density, light weight material well suited for airborne and satellite communications antennas, point-to-point digital radio antennas, and light weight feed networks. RT/duroid 5880LZ circuit materials combine a low relative dielectric constant of 1.96 and low dissipation factor of typically 0.0019, both in the z-axis at 10 GHz, for usable performance to Ku-band frequencies and beyond. These laminates can be easily cut, sheared, and machined and boast a low density of 1.4 g/cm3.
Rogers 2929 bondply is an unreinforced thermoset resin-based thin film adhesive system ideal for constructing reliable, multilayer circuits. It has a low dielectric constant of 2.94 in the z-axis at 10 GHz, with a low loss tangent of less than 0.003 also in the z-axis at 10 GHz. Well-suited for creating multilayer circuit boards with many of Rogers’ high-performance composite dielectric materials, including Rogers RT/duroid 6000, RO4000®, and RO3000® Series laminates, 2929 bondply materials are based on a proprietary cross-linking resin system that makes the adhesive system compatible with sequential bond processing techniques.