RO3003(TM) LaminatesRogers Corporation’s (NYSE: ROG) Advanced Circuit Materials Division, introduced rolled copper cladding options including the RO3003™ high frequency circuit material. This is a ceramic-filled PTFE composite intended for use in commercial microwave and RF applications.

RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.

Typical Applications

  • Automotive radar
  • RF Couplers
  • Cost sensitive aerospace and defense applications
  • GPS Antennas

RO3003 3.0 dielectric constant laminates are now available with rolled copper foils from ½ ounce up to 0.040” thick rolled copper plate, further reducing insertion loss.