Rogers Corp. will be exhibiting and educating at the 2015 International Microwave Symposium (IMS) May 17-22, 2015 at the Phoenix Convention Center in Phoenix, Ariz.

During the 2015 IMS Exhibition (May 19-21, 2015), representatives from Rogers Corp. will be available at Booth 3640 to assist visitors with details about their industry-leading printed-circuit-board (PCB) materials, including RO4835™ and RO4360G2™ high-frequency laminates and COOLSPAN® TECA thermally and electrically conductive adhesive films. Rogers Corporation’s representatives will also share some of their excitement for the firm’s recent acquisition of Arlon LLC, a leading circuit material supplier (, and how the addition of Arlon’s people and products has strengthened the newly expanded Rogers Corp. In the IMS technical sessions, John Coonrod will be actively participating in numerous short courses and workshops.

RO4835 high-frequency laminates are well suited for circuit applications requiring excellent performance stability with time and temperature. These RoHS-compliant materials were developed with improved oxidation resistance but can be processed with standard FR-4 material methods for reduced production costs. RO4835 laminates exhibit a dielectric constant (Dk) of 3.48 at 10 GHz with a low loss tangent of 0.0037 at 10 GHz. The low z-axis coefficient of thermal expansion (CTE) provides high plated-through-hole (PTH) reliability under a variety of processing and operating conditions. RO4360G2 laminates offer a higher Dk of 6.15 at 10 GHz and can also be processed with FR-4 methods for reduced production costs. The higher Dk value allows designers to develop circuits with smaller dimensions for a given operating frequency, for tighter packaging.

COOLSPAN TECA film is a thermally and electrically conductive adhesive film that helps solve many circuit thermal management issues. This thermoset, epoxy-based adhesive offers a straightforward means of attaching circuits to heat-bearing structures, such as heatsinks.

In the IMS technical sessions, John Coonrod, author of the popular “ROG” blog series, will make two MicroApps presentations as well as a Friday, May 22 workshop session on proper thermal management of RF/microwave printed-circuit-board (PCB) materials. The MicroApps presentations are short but concise applications-based sessions that provide practical solutions in specific technical areas. The first MicroApps presentation, scheduled for Tuesday, May 19, helps designers evaluate different transmission-line approaches: “Microwave PCB Structure Selection: Microstrip vs. Grounded Coplanar Waveguide. The second MicroApps presentation, set for Wednesday, May 20, reviews the importance of fabrication techniques on high-frequency performance: “PCB Fabrication Influences on Microwave Performance.” The Friday workshop, WFE-1, “An Overview of Various Critical Thermal Management Issues for Microwave PCBs,” is part of the morning WFE workshop session (8 AM - 12 noon) on thermal management: “Thermal Management of High-Density Electronic Assemblies.” It provides engineers with the opportunity to compare different approaches for reducing and removing heat from their high-frequency designs.

The 2015 IMS ( is the largest annual technical gathering for the RF/microwave industry, with more than 550 exhibiting company booths and typically more than 10,000 visitors in attendance. It combines excellent technical sessions and presentations with an exhibition floor that is also educational, with company representatives eager and willing to assist visitors with their product and engineering issues.

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