Items Tagged with 'thermal'

Rogers Corp.'s Advanced Connectivity Solutions (ACS) will feature examples of its high-performance circuit and thermal management materials for the most demanding electronic designs and working environments at DesignCon 2017, January 31-February 2, 2017 (exhibition from February 1-2, 2017) in the Santa Clara Convention Center (Santa Clara, CA). DesignCon is a premiere event for electronic design engineers working on circuit and system levels.

With the latest release of ANSYS AIM, organizations can accelerate product design through upfront simulation, mitigate late-stage design changes, and reduce the number of costly physical prototypes. Now available, ANSYS AIM 17.2 enhances engineering simulation for thermal management, extends collaboration between designers and analysts, and brings upfront simulation to Japanese engineers in their own language.

Rogers Corp. is exhibiting at the 2016 IEEE MTT-S International Microwave Symposium (IMS) May 24-26, at the Moscone Center in San Francisco, Calif., Booth #2039. IEEE MTT-S IMS is the microwave industry’s largest international gathering of RF/microwave professionals, with over 600 exhibition booths and more than 8,000 attendees expected.

Engineers at BE CAE & Test (Catania, Italy) have taken the simulation process well beyond the typical approach of “run a test / deliver a report.” Instead, using the COMSOL Multiphysics software and the Application Builder, they have created a series of easy-to-use custom applications that perform state-of-the-art virtual prototyping of their customers’ surface-mount device designs. The apps hide the complexity of the underlying detailed model, yet still provide access to the powerful functionality of the simulation.

Rogers Corp.’s Power Electronics Solutions (PES) group provides some of the world’s leading high-power and thermal management materials solutions with its ROLINX® and curamik® product lines.

Rogers Corp.'s Power Electronics Solutions (PES) group plans a strong presence at the upcoming SPIE Photonics West Conference and Exhibition, set for February 13-18, 2016 in San Francisco’s famed Moscone Center.

Santier, a leading custom thermal management solutions provider with a full range of heat sinks for electronic packaging, announced the addition of Mansoor Mosallaie as vice president of operations. 

Keysight Technologies Inc. demonstrated the Advanced Design System (ADS) Electro-Thermal Simulator at the IEEE MTT-S International Microwave Symposium (IMS) 2015, Booth 739, Phoenix, May 17-22. The solution provides accurate, temperature aware IC simulation results by using device temperatures that take into account thermal coupling and thermal characteristics of the RFIC/MMIC component packaging.

Rogers Corp. to show high performance circuit materials and assist with thermal management at 2015 IEEE International Microwave Symposium.