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ARTICLES

Rogers’ advanced circuit-material solutions to be on display at IMS

May 21, 2014

Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.


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Rogers Corp. releases video on innovation center opening

May 5, 2014

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.


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Rogers to exhibit high performance materials at Del Mar Electronics Show

April 16, 2014

Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.


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COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film

March 27, 2014

TECA FilmRogers Corp. advanced circuit materials division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance. COOLSPAN TECA Film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.


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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

March 6, 2014

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.


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Rogers highlights materials high performance circuits at DesignCon 2014

January 21, 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.


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Rogers launched thermally and electrically conductive adhesive film

January 16, 2014

Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.


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Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013

September 17, 2013

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).


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Antenna Grade Laminates: RO4700JXR(TM) Series

August 15, 2013

RO4700JXRseries

Rogers’ improved high frequency materials address several market needs. The improved RO4700JXR™ Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.


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Rogers launches high frequency laminate material with improved thermal reliability for higher MOTs

May 30, 2013

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).


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