Rogers Corp.

Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.

More cushioning and sealing, less wasted space, enables thinner designs. As handheld devices decrease in size and increase in functionality, achieving the proper balance of sealing and protection with the requirements of an ultra thin application can be an extreme design challenge. To help address this need, Rogers Corporation has specifically engineered the PORON ThinStik family of self-adhesive solutions.

Rogers Corp.’s Power Distribution Systems Division has announced an innovative new solution for emerging power electronics applications: RO-LINX® PowerCircuit™ busbars. The PowerCircuit solution was developed to meet the growing power distribution demands in electric vehicle (EV) drives, hybrid electric vehicle (HEV) drives and related charging systems.

The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.

Rogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.

The Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for excellent mechanical stability compared to PTFE woven glass.

Rogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium.

The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.

The Durel Division of Rogers Corporation has announced an addition to its high-performance electroluminescent (EL) lamp driver integrated circuits (ICs) - D392A. The D392A EL lamp driver delivers the programmable output voltages needed to power a wide range of EL lamps, including in portable applications such as cellular telephones, data organizers and PDAs, remote controls, monochrome LCDs, and DFLX™ EL keypad lamps.

Rogers Corp.'s RT/duroid® 6035HTC is a high-thermal-conductivity (HTC) laminate material engineered for low loss in high power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high reliability (hi-rel) applications required to handle high power levels, such as power amplifiers. Rogers RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz.

RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm³).

Rogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA,  including Theta™ printed circuit materials, ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® LoPro™ circuit board materials.Theta laminates and prepregs are environmentally friendly, high-performance FR-4 materials compatible with lead-free assembly processing.

Rogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its advanced printed circuit board (PCB) materials at the upcoming Del Mar Electronics & Design Show (www.vts.com/delmar).

Rogers Corp., represented by its High Performance Foams Division (HPF), will be exhibiting its Silfx™ lightweight silicone comfort foam at the upcoming Aircraft Interiors Expo 2013.

Rogers Corp., represented by its Power Electronics Solutions (PES) Division, will showcase some of its most advanced products for power electronic applications at the upcoming APEC 2013 conference and exhibition.

Rogers Corp. will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition.

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

Rogers Corp., a leading supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.

Families in Northeastern Connecticut are gearing up for a fun day of activities to help combat hunger by attending the first annual Harvest for Hunger event, Sunday, October 14, at Fort Hill Farms in Thompson, CT. Sponsored by the employees of Rogers Corp. and Fort Hill Farms, the event will be held from 11 a.m. to 5 p.m. A variety of fund-raising activities at the event will benefit Connecticut Food Bank’s mobile pantry and food programs of Thompson Ecumenical Empowerment Group (TEEG).

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).

Rogers Corp.’s High Performance Foams Division will be exhibiting its range of performance material solutions for railcar applications at the upcoming Innotrans international fair for transport technology, September 18-21, in Berlin (Rogers location at Stand 101 in Hall 3.1).

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams. 

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (satcom) electronic applications at the upcoming Satellite 2012 Exhibition. 

Rogers Corp. announced the appointment of Jeffrey Grudzien as Vice President of its Advanced Circuit Materials Division, replacing Michael Bessette, who is retiring after 37 years with the company.

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (SATCOM) electronic applications at the upcoming Satellite 2012 Exhibition.

Rogers Corp., represented by its Power Distribution System (PDS) Division, will showcase some of its more popular products for power electronics applications at the upcoming Motor, Drive & Automation Systems Conference, March 13-14, at the Rosen Plaza Hotel in Orlando, FL.

In-depth look at building a better EM simulation model that includes the effects of a PCB’s metal surface roughness, microstrip and coplanar waveguide circuits while closely comparing to find the best fit for different applications