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Rogers Corp.

Company Profile

Contact Information

Phone: (480) 961-1382
Fax: (480) 961-4533

Location

Rogers Corp.
100 S. Roosevelt Avenue
Chandler AZ 85226
United States
Rogers Advanced Circuit Materials Division manufactures quality, high performance laminates. With manufacturing locations in the United States, Belgium and China, we supply proven laminate solutions for high frequency applications in the wireless base station, defense/aerospace, automotive, high-speed digital and advanced chip packaging markets across the globe. We take pride in our innovation to meet the evolving expectations of the electronics industry.

Products

Thermally / Electrically Conductive Adhesive (TECA) Film

March 27, 2014

TECA FilmRogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.

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Antenna Grade Laminates: RO4700JXR(TM) Series

August 15, 2013

RO4700JXRseries

Rogers’ improved high frequency materials address several market needs. The improved RO4700JXR™ Series antenna grade laminates were designed for use in base station, RFID and other antenna designs and combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.

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New PORON Dura-Shape Option

January 17, 2011

RogersDuraShape_100Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.

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PORON® ThinStik™ Materials

January 17, 2011

ThinStikMore cushioning and sealing, less wasted space, enables thinner designs. As handheld devices decrease in size and increase in functionality, achieving the proper balance of sealing and protection with the requirements of an ultra thin application can be an extreme design challenge. To help address this need, Rogers Corporation has specifically engineered the PORON ThinStik family of self-adhesive solutions.

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PowerCircuit™ Busbars

January 17, 2011

Busbar

Rogers Corp.'s Power Distribution Systems Division has an innovative new solution for emerging power electronics applications: RO-LINX® PowerCircuit™ busbars. The PowerCircuit solution was developed to meet the growing power distribution demands in electric vehicle (EV) drives, hybrid electric vehicle (HEV) drives and related charging systems.

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RO3730™ Laminate Materials

January 17, 2011

R03730LaminateThe Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.

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RO4360 High Frequency Laminates

January 17, 2011

RO4360HFlaminatesRogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.

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RO4360 Laminates

January 17, 2011

RO4360LaminatesThe Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced RO4360™ laminates, developed for the special requirements of high-frequency amplifier designers. RO4360 laminates feature a dielectric constant of 6.15 and loss of 0.003 at 2.5 GHz. The laminates are based on a ceramic-filled, thermoset resin system reinforced by glass fiber for excellent mechanical stability compared to PTFE woven glass.

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RO4460™ Prepreg and RO4360™ Laminates

January 17, 2011

4460prepregRogers Corporation has developed the perfect prepreg match to its popular RO4360™ laminates: RO4460™ prepregs. Both materials feature consistent dielectric constant (Dk) of 6.15 ± 0.15 and low dielectric loss of 0.003 at 2.5 GHz. Together, they form an ideal system for fabricating compact, cost-sensitive multilayer amplifiers, antennas, and other high-frequency circuits where space is at a premium.

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RO4730™ LOPRO™ Laminates

January 17, 2011

RO4730LOPROThe Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.

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Rogers D392A EL Lamp Driver IC

January 17, 2011

LampDriverThe Durel Division of Rogers Corporation has announced an addition to its high-performance electroluminescent (EL) lamp driver integrated circuits (ICs) - D392A. The D392A EL lamp driver delivers the programmable output voltages needed to power a wide range of EL lamps, including in portable applications such as cellular telephones, data organizers and PDAs, remote controls, monochrome LCDs, and DFLX™ EL keypad lamps.

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RT/Duroid 6035HTC Laminate

January 17, 2011

6035HTCRogers Corp.'s RT/duroid® 6035HTC is a high-thermal-conductivity (HTC) laminate material engineered for low loss in high power circuits. The fluoropolymer composite material is ideal for RF and microwave applications in military and high reliability (hi-rel) applications required to handle high power levels, such as power amplifiers. Rogers RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz.

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RT/duroid® 5880LZ Laminates

January 17, 2011

RTduroid5880LZRT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3).

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Theta™ Printed Circuit Materials

January 17, 2011

ThetaPRRogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA,  including Theta™ printed circuit materials, ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® LoPro™ circuit board materials.Theta laminates and prepregs are environmentally friendly, high-performance FR-4 materials compatible with lead-free assembly processing.

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ULTRALAM® 3000/RO2808™/RO4000®

January 17, 2011

UltralamRogers Advanced Circuit Materials (ACM) Division employees will be at IMAPS Device Packaging 2010, offering information on ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® circuit board materials, including the recently launched RO4360™ laminate (6.15 Dk), which many in the field believe is a very effective cost-down replacement for LTCC (low temperature co-fired ceramic) packaging designs.

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News

Rogers Corp. introduces RO3000 laminates with rolled copper foils

September 24, 2014

 Rogers Corp.’s Advanced Circuit Materials Division, a global leader in Microwave Printed Circuit Board (PCB) Materials, recently introduced rolled copper cladding options with its RO3003™, RO3035™ and RO3203™ low dielectric constant laminate materials 

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Rogers Corp. launches free app for apple and android devices

August 14, 2014

 Rogers Corp.’s Advanced Circuit Materials Division launched ROG Mobile, a free mobile app for apple and android devices. The new app allows users to access Rogers’ calculators, including the popular MWI (Microwave Impedance) simulation tool, literature, technical papers and the ability to order samples, all while on the go with their smart phones and tablets. 

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Rogers’ advanced circuit-material solutions to be on display at IMS

May 21, 2014

Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.

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Rogers Corp. releases video on innovation center opening

May 05, 2014

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.

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Rogers to exhibit high performance materials at Del Mar Electronics Show

April 16, 2014

Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.

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Rogers highlights latest circuit materials & PCB techniques at IPC APEX EXPO

March 06, 2014

Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.

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Rogers highlights materials high performance circuits at DesignCon 2014

January 21, 2014

Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.

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Rogers launched thermally and electrically conductive adhesive film

January 16, 2014

Rogers Corp. Advanced Circuit Materials Division launched COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA) Film providing reliable high temperature performance.

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Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013

September 17, 2013

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).

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Rogers launches high frequency laminate material with improved thermal reliability for higher MOTs

May 30, 2013

Rogers Corp. Advanced Circuit Materials Division launched next generation RO4360G2™ laminates with improved thermal reliability for higher UL MAXIMUM OPERATING TEMPERATURES (MOTs).

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Rogers shows advanced circuit material solutions and offers design guidance at IMS 2013

May 20, 2013

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.

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Rogers to display latest high frequency material advances for digital and analog circuit designers at the 2013 Del Mar Electronics & Design Show

April 17, 2013

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its advanced printed circuit board (PCB) materials at the upcoming Del Mar Electronics & Design Show (www.vts.com/delmar).

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Rogers to exhibit Silfx lightweight silicone comfort foam for aircraft seating

April 01, 2013

Rogers Corp., represented by its High Performance Foams Division (HPF), will be exhibiting its Silfx™ lightweight silicone comfort foam at the upcoming Aircraft Interiors Expo 2013.

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Rogers to show range of for power conversion and distribution solutions at APEC 2013

March 08, 2013

Rogers Corp., represented by its Power Electronics Solutions (PES) Division, will showcase some of its most advanced products for power electronic applications at the upcoming APEC 2013 conference and exhibition.

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Rogers to show high performance circuit materials at Satellite 2013

March 04, 2013

Rogers Corp. will be showcasing its high performance circuit materials for commercial and military satellite communications (satcom) electronic applications at the upcoming Satellite 2013 Exhibition.

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Rogers to display PCB materials at the 2013 IPC APEX EXPO

February 19, 2013

Rogers Corp., a supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

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Rogers to display materials and present at IPC APEX EXPO 2013

February 05, 2013

Rogers Corp., a leading supplier of high frequency laminate materials for circuit boards in amplifiers, antennas, switches, and microwave radios, will highlight several of its high-quality printed circuit board (PCB) materials at the upcoming IPC APEX EXPO® Conference & Exhibition.

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Rogers to show high-performance laminates and bondply materials at electronica 2012

November 12, 2012

Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show. Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a wide range of business sectors, including automotive, medical, consumer, commercial, military and general wireless markets. The electronics trade show attracts press coverage from 22 countries and more than 500 technical publications.

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Rogers to showcase high performance printed circuit board materials at EuMW 2012

October 19, 2012

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.

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Rogers employees sponsoring Harvest for Hunger to benefit local hunger programs

October 09, 2012

Families in Northeastern Connecticut are gearing up for a fun day of activities to help combat hunger by attending the first annual Harvest for Hunger event, Sunday, October 14, at Fort Hill Farms in Thompson, CT. Sponsored by the employees of Rogers Corp. and Fort Hill Farms, the event will be held from 11 a.m. to 5 p.m. A variety of fund-raising activities at the event will benefit Connecticut Food Bank’s mobile pantry and food programs of Thompson Ecumenical Empowerment Group (TEEG).

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Rogers welcomes PCB West 2012 visitors with product news and design/manufacturing guidance

September 13, 2012

Rogers Corp. will be participating in the PCB West 2012 Conference & Exhibition in both the technical program and the exhibition floor. The PCB West 2012 Conference & Exhibition (www.pcbwest.com) features a three-day technical conference (September 25-27) and one-day exhibition hall (September 26). Rogers Corporation (www.rogerscorp.com) welcomes visitors to join them for the PCB West 2012 Conference & Exhibition to learn more about the practical use of its high performance PCB materials.

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Rogers to highlight trio of antenna circuit materials at Mobile Antenna Systems 2012

September 10, 2012

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).

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Rogers Corp. will ride the rails at Innotrans 2012

August 30, 2012

Rogers Corp.’s High Performance Foams Division will be exhibiting its range of performance material solutions for railcar applications at the upcoming Innotrans international fair for transport technology, September 18-21, in Berlin (Rogers location at Stand 101 in Hall 3.1).

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Rogers to introduce new circuit material solutions at IMS 2012

May 30, 2012

Rogers Corp. and representatives of its Advanced Circuit Materials Division will be at the upcoming 2012 IEEE International Microwave Symposium (IMS) to help attendees learn more about Rogers’ wide range of high frequency circuit materials.

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Rogers appoints new president of Asia region

May 02, 2012

Rogers Corp. announced the appointment of Helen Zhang as President of Asia Region to oversee the company’s growing business in Greater China and throughout the Asia-Pacific region. Zhang will be responsible for driving Rogers’ growth strategy in Asia across the company’s three core businesses of printed circuit materials, power electronics solutions and high performance foams. 

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Rogers Corp. to display laminate solutions at DMEDS

April 18, 2012

Rogers Corp. will be offering a wide range of its high performance circuit board materials at the upcoming Del Mar Electronics & Design Show on May 2-3, 2012 at the Del Mar Fairgrounds in San Diego, CA. Representatives from Rogers Advanced Circuit Materials Division will be available at Booth #622 to help visitors obtain optimum performance using the company’s many different circuit board material offerings.

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Rogers to highlight high-reliability laminates for satellite communications at Satellite 2012

March 13, 2012

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (satcom) electronic applications at the upcoming Satellite 2012 Exhibition. 

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Rogers Corp. appoints Jeffrey Grudzien to lead its ACM division

February 28, 2012

Rogers Corp. announced the appointment of Jeffrey Grudzien as Vice President of its Advanced Circuit Materials Division, replacing Michael Bessette, who is retiring after 37 years with the company.

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Rogers to highlight pair of high-flying laminates at Satellite 2012

February 27, 2012

Rogers Corp. will be highlighting two of its leading printed-circuit-board (PCB) laminate materials for commercial and military satellite-communications (SATCOM) electronic applications at the upcoming Satellite 2012 Exhibition.

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Rogers to show and present power electronics solutions

February 27, 2012

Rogers Corp., represented by its Power Distribution System (PDS) Division, will showcase some of its more popular products for power electronics applications at the upcoming Motor, Drive & Automation Systems Conference, March 13-14, at the Rosen Plaza Hotel in Orlando, FL.

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Rogers to discuss material solutions at APEX IPC 2012

February 07, 2012
Rogers Corp. will be attending the IPC APEX EXPO® Conference & Exhibition scheduled for February 28 through March 1, 2012, at the San Diego Convention Center in San Diego, Calif. Read More

Rogers combines DesignCon presentation with products

February 03, 2012
Rogers Corp. exhibited and presented a white paper concerning thermal conductivity at the DesignCon 2012 conference and exhibition. DesignCon, held January 31 through February 1, 2012, at the Santa Clara Convention Center, Santa Clara, Calif., is one of the electronic industry’s key meeting places for printed-circuit-board (PCB) designers. Read More

Rogers to showcase power electronics products at APEC 2012

February 03, 2012
Rogers Corp., represented by its Power Electronics Solutions (PES) Business Group, will showcase some of its more popular products for power electronics applications at the upcoming APEC 2012 conference and exhibition. Read More

Rogers' vibration isolation material meets global rail specifications

January 27, 2012
Rogers Corp.’s High Performance Foams Division introduces the next generation in dynamic flooring materials for railway and mass transit applications with its new L3 Première vibration isolation material. Read More

Improved Thermal Management of Microwave PCBs Using Advanced Circuit Materials

November 06, 2011
Thermal management in microwave printed-circuit boards (PCB) is more important than ever, with the growing demand for higher levels of circuit integration and PCB power densities. Understanding proper thermal management of a microwave PCB requires some basic theory regarding heat flow in a PCB, as well as the thermal... Read More

Rogers To Showcase Materials at Productronica 2011 in Germany

October 26, 2011
Rogers Corp. , a supplier of high performance printed circuit boards for use in high frequency applications and harsh environments, including defense, aerospace, telecommunications and automotive, will showcase some of its materials at Productronica 2011 from November 15 to 18 in the New Munich Trade Fair Centre in Munich,... Read More

Rogers to Show High Performance Circuit Materials and Offer Circuit-Design Insight

October 06, 2011
Rogers Corp. Advanced Circuit Materials Division (ACMD) will display its high performance circuit-material solutions October 11-13 at the 2011 European Microwave Week exhibition in Manchester, UK. Rogers will also take part in the technical conference, as Rogers ACMD’s Market Development Engineer, John Coonrod, will shed light on how to... Read More

Rogers Names New President, CEO

September 26, 2011
Rogers Corp. announced that its Board of Directors has elected a new President and Chief Executive Officer, Bruce D. Hoechner, effective October 3, 2011, at which time he will also become a member of the company’s Board of Directors. Hoechner, 51, will succeed Robert D. Wachob, 64, who will... Read More

Rogers to Show its Bisco Silicone Products for Rail Transport Applications at the APTA Show

September 23, 2011
The High Performance Foams Division of Rogers Corp. will be exhibiting its BISCO® MF-1™ seating materials and BISCO L3 foams for use in rail transport flooring systems at the American Public Transportation Association (APTA) show to be held in New Orleans, LA, (Booth 5254), on October 3 to 5.... Read More

Rogers High Performance Foams Division Earns Award from Boeing

August 05, 2011
The High Performance Foams Division of Rogers Corp. , located in Chicago, IL, has been awarded a Silver Performance Excellence Award for 2010 by Boeing. The Boeing Performance Excellence Award is given to Boeing suppliers for superior supplier performance over a year’s time. In conveying the award announcement to... Read More

Rogers Offers Circuit Materials, Design Guidance

May 20, 2011
Representatives from Rogers Corp.'s Advanced Circuit Materials Division (ACMD) will be on hand at IMS 2011 to share insights on the optimum use of the company’s high performance circuit materials, including its RT/duroid® 6035HTC and RO4360™ laminates. Members of Rogers ACMD will be on hand at Booth 2515 to... Read More

Rogers Launches New Solutions For Power and Thermal Management

May 16, 2011
Rogers Corp. will be well represented at the PCIM Europe 2011 by two of its divisions offering practical power solutions: Rogers BVBA Power Distribution Systems Division and Rogers Thermal Management Solutions Division. Recently acquired Curamik Electronics GmbH will also be in attendance at PCIM. Power Conversion Intelligent Motion (PCIM)... Read More

Rogers Opens New Circuit Materials Production Facility in China

May 05, 2011
Rogers Corp.’s Advanced Circuit Materials Division (ACMD) opened a new production facility April 13 in Asia, one of its largest market regions. Rogers’ new ACMD Suzhou, China manufacturing facility represents a major investment in the modern China Suzhou Innovation Park. This ACMD dedicated production facility significantly increases Rogers’ global... Read More

Rogers Promotes Halogen-free Laminates and Free Design Software

January 18, 2011
Rogers Corp. will be showing off some of its latest materials as well as a free design program at this year’s DesignCon® 2011 exhibition (Santa Clara Convention Center, Santa Clara, CA, February 1-2, 2011). DesignCon, the first major electronics industry event of the year, is a key forum for... Read More

Articles

Comparing Microstrip and CPW Performance

July 12, 2012

In-depth look at building a better EM simulation model that includes the effects of a PCB’s metal surface roughness, microstrip and coplanar waveguide circuits while closely comparing to find the best fit for different applications

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Downloads

Rogers' Durable Electronics & Lighting Solutions

This brochure provides a detailed overview of Rogers’ comprehensive capabilities in screen-printed electronics and associated services, gained from over 20 years of design and high volume manufacturing experience in printed electronics, low power EL backlighting systems and EL driver ICs.

Download

BISCO® Silicone Materials

A new 16-page Material Selection Guide for its BISCO® Silicone material. These materials, which are offered in cellular, solid and specialty grades, are used in a wide range of markets, from transportation and communications to electronics and high intensity lighting. Applications include gaskets and seals, high temperature PCB thermal insulation and battery shields, automotive heat shields, and vibration and acoustic mitigation pads.

Download

High Frequency Laminates

Product Selector Guide

Download

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