Articles by UltraSource Inc.

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 

Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”

UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.