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ARTICLES

UltraSource Inc. announces PolyVia – a reduced cost plugged via

June 18, 2014

 UltraSource, Inc. announced that it has developed a reduced cost plugged via option called PolyVia.  PolyVia was recently showcased at the IEEE-IMS, Tampa Bay, on June 3-5.  The PolyVia product is a polyimide-based plugged via option that customers can add to their plated-through hole designs in order to stop epoxy or solder bleed-thru during assembly operations. 


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UltraSource Inc. featured in “Microwave and Millimeter-Wave Electronic Packaging”

March 13, 2014

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.


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UltraSource announces new process capability – ENEPIG: The "Universal Finish"

October 30, 2013

Michael Casper, president and CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that they have developed a high density (HD) thin film based ENEPIG process that now combines low cost sputtering, traditional thin film photolithography and etching, and plating with ENEPIG. 


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UltraSource releases capabilities addition on ultra-thin substrates

May 30, 2013

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”. 


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UltraSource to present thin film circuit design solutions at IMS 2013

May 28, 2013

UltraSource Inc., an industry leader in delivering thin film on ceramic manufacturing solutions, will be showcasing several of its technologies at this year’s IMS 2013 held at the Washington State Convention Center in Seattle, Washington June 4-6. 


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UltraSource releases application note: How CAD file quality affects thin film design success

March 26, 2013

Michael Casper, president and CEO of UltraSource Inc., a thin film microchip manufacturer, is pleased to announce the update of an application note on the company's website titled: “How Your CAD File Affects the Success of Your New Thin Film Design.”


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UltraSource announces backside treatment for thin film epoxy adhesion

February 14, 2013

UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that the company now offer a cost effective backside treatment process to all customers wishing to attach thin film components with epoxies and improve the adhesion and reliability of bonding. 


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UltraSource releases new thin film microcircuit CopperVia

January 16, 2013

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.


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UltraSource Inc. releases new thin film microcircuit CopperVia

June 7, 2012

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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UltraSource Unveils Rapid Prototyping Program

June 1, 2011
Michael Casper, President and CEO of UltraSource Inc. , a thin film ceramic microchip manufacturer announced the UltraFAST® Rapid Prototyping Guarantee Program: "It Ship’s on Time or IT’S FREE!" This guarantee will be introduced at the IMS2011 show being held in Baltimore. UltraSource will be located at Booth 1435....
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