Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.
As strange as it may sound, the use of circuit defects is a growing trend in high-frequency circuit design, especially for passive circuits such as filters. More precisely, the trend is in the increased use of defected ground structures (DGSs) and defected microstrip structures (DMSs) to alter the responses of microstrip circuit designs. Just what are these DGS and DMS forms, and does incorporating them into a high-frequency circuit change the way the PCB material should be specified?
The transition, from a waveguide or coaxial connector to the PCB, is critical to the performance of the circuit, and the PCB’s thickness can impact how an end launch transition is made. Waveguide and coaxial connectors come in many shapes and sizes, as do PCB thicknesses, and matching the connector to the substrate thickness can play a large role in the overall performance and reliability of that design.
The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.
In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.
LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.
Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.