Materials/Packages

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Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.

Isola Group S.a.r.l.announced that its six-member IS680 copper-clad laminate family is now in production at its facility in Dueren, Germany.

The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.

In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.

LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.

Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.