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NXP introduces first 3 A transistors in 1.1 mm² leadless plastic package

November 4, 2013

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

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Nujira selects ASE as packaging and test partner for handset ET chip

September 9, 2013

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.

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Isola expands production of RF/microwave materials in Germany to support European OEMs

July 15, 2013

Isola Group S.a.r.l.announced that its six-member IS680 copper-clad laminate family is now in production at its facility in Dueren, Germany.

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PCB Considerations For Defected Structures

April 4, 2012
As strange as it may sound, the use of circuit defects is a growing trend in high-frequency circuit design, especially for passive circuits such as filters. More precisely, the trend is in the increased use of defected ground structures (DGSs) and defected microstrip structures (DMSs) to alter the responses of microstrip circuit designs. Just what are these DGS and DMS forms, and does incorporating them into a high-frequency circuit change the way the PCB material should be specified?
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Learning To Launch Onto Different Circuit Thicknesses

March 20, 2012
The transition, from a waveguide or coaxial connector to the PCB, is critical to the performance of the circuit, and the PCB’s thickness can impact how an end launch transition is made. Waveguide and coaxial connectors come in many shapes and sizes, as do PCB thicknesses, and matching the connector to the substrate thickness can play a large role in the overall performance and reliability of that design.
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Plessey Semiconductors sensor product of UK’s NanoKTN project

March 12, 2012

The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.

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MSC distributes Precision Devices' Products in DACH region

March 5, 2012

In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.

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UHF narrow band telecommand modules available from LPRS

February 24, 2012

LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.

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Infineon and Fairchild expand power MOSFET partnership

February 13, 2012

Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.

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Off to the Races: Creating Winning Finishes

February 8, 2012
As promised, we are off to the races, untangling the convoluted subject of PCB surface finishes.  This is a complicated subject, so bear with me as I try to break it down into bite-sized, manageable portions! This week I will discuss each available surface finish and the pros and cons of each one.
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