Materials/Packages

Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.


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North American debut of first ever hybrid milling/laser prototyping system by LPKF

Attendees of the 2014 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth #1108. LPKF has announced that they will be debuting the first ever hybrid milling/laser prototyping system, the ProtoMat D104. Also at the show will be a UV laser prototyping system, the ProtoLaser U3. The show will be hosted in Tampa, FL., June 3-5 at the Tampa Convention Center.


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Rogers Corp. releases video on innovation center opening

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.


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