Materials/Packages | Microwave Journal

Plessey Semiconductors sensor product of UK’s NanoKTN project

March 12, 2012

The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.

MSC distributes Precision Devices' Products in DACH region

March 5, 2012

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In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.

UHF narrow band telecommand modules available from LPRS

February 24, 2012

LPRS

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LPRS, Europe’s leading supplier of short-range radio devices announced the availability of the multi-channel telecommand transmitter and receiver modules. The new CDT-TX-02M-R and CDT-RX-02M-R modules offer long range control, low voltage operation with low current consumption for reliable battery operation and CDT-01-compatible communication format.

Infineon and Fairchild expand power MOSFET partnership

February 13, 2012

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Infineon Technologies and Fairchild Semiconductor have extended their compatibility partnership to encompass Infineon’s proprietary 5 x 6 power stage asymmetric dual MOSFET package. The PowerStage 5 x 6 is a leadless SMD package, which integrates the low-side and high-side MOSFET of a synchronous DC/DC converter into a 5 by 6 mm² package outline.

Off to the Races: Creating Winning Finishes

February 8, 2012

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As promised, we are off to the races, untangling the convoluted subject of PCB surface finishes. This is a complicated subject, so bear with me as I try to break it down into bite-sized, manageable portions! This week I will discuss each available surface finish and the pros and cons of each one.

Picking Prepregs For Peak Performance

February 8, 2012

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Multilayer printed-circuit boards (PCBs) have gained in popularity as designers seek to shrink their circuits. They offer the opportunity to stack a wide range of functions on one multilayer design, even combine analog, digital, and microwave circuits on a single circuit assembly. Designers have learned how to stack laminates with different relative dielectric constants, such as PTFE-based laminates and FR-4, in compact multilayer circuits, but creating such circuits requires careful planning and a good understanding of the role that bonding films and prepregs play in multilayer circuits.

SemiGen Opens RF Supply Center

December 22, 2011

SemiGen Inc.

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SemiGen Inc. , an RF/microwave assembly and automated PCB manufacturing house, has announced the opening of its new RF Supply Center and will begin accepting orders for epoxies, bonding tools, gold wire and other supplies used in the manufacture and test of microwave modules and components on January 3rd,...

Remtec Has Developed Innovative Flip Chip Packaging

November 18, 2011

Remtec

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Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...

Sweden Invests SEK 40 million in Development of Graphene

November 14, 2011

Chalmers University of Technology

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Chalmers University of Technology will receive the lion's share of a SEK 40 million Swedish research grant for the investigation of the "supermaterial" graphene. Following the new financing from the Knut and Alice Wallenberg Foundation, a group of some 30 Swedish graphene researchers will be formed, in close collaboration...