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June 2013 Digital Edition Online Edition

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Real-Time USB Power Sensor

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Powering the Next Seven Billion Voices

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Less is More: The New Mobile RF Front-End

Qualcomm discusses the features and innovations of the new RF360 CMOS mobile RF front-end.

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Nujira beats own world record for ET PA linearity

Less is More: The New Mobile RF Front-End

Sunny Seattle - IMS2013 Product Review

TriQuint accelerates GaN offerings, releases significant new products and foundry services

Silicon Labs acquires Energy Micro

Nice meeting you! - IMS Seattle 2013: Sunny Side-Up

- Less is More: The New Mobile RF Front-End

Eng. Manager - Technique to Minimize Phase Noise of Crystal Oscillators

CEO - Technique to Minimize Phase Noise of Crystal Oscillators

e.e - CMOS Gate Driver: IXRFD630

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Remtec

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ARTICLES

Remtec Expands DBC Substrate Capabilities

May 7, 2012
Remtec
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Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing.


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Remtec Has Developed Innovative Flip Chip Packaging

November 18, 2011
Remtec
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Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...
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