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ARTICLES

Remtec Expands DBC Substrate Capabilities

May 7, 2012

Remtec®, the leading manufacturer of substrates and packages with Plated Copper On Thick Film (PCTF®), has significantly expanded its activity in the design and fabrication of DBC ceramic products for military and commercial applications in small to medium production volumes with fast prototyping and economic pricing.


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Remtec Has Developed Innovative Flip Chip Packaging

November 18, 2011
Remtec , a leader in ceramic packages based on Plated Copper on Thick Film (PCTF) technology, has developed an efficient, cost effective chip scale packaging approach for flip chip power devices. It allows for simple, effective packaging of various Si, SiC and GaN FET transistors -- MOSFETs and eGAN...
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