- Buyers Guide
Indium Corp.’s Dr. Ning-Cheng Lee, vice president of technology, Dr. Yan Liu, research chemist, Joanna Keck, research technician and Erin Page, research technician, were awarded Honorable Mention for their paper "Voiding and Drop Test Performance of Lead-Free Low-Melting and Medium-Melting Mixed Alloy BGA Assembly" at the opening ceremony of the IPC APEX Expo on March 25.
What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corp., it takes foresight and dedication.
Indium Corp. announces that Tony Teo has been hired as associate director for sales and marketing for the Asia-Pacific region, including China.
Indium Corp. will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Indium Corp. announces that Tim Jensen has been named the senior product manager for engineered solders.
Indium Corp. announces that Glen Thomas has been named product manager for PCB assembly solder paste.
Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12.
Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.
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