Articles Tagged with ''silicon''

Infineon Technologies AG and Panasonic Corp. have announced an agreement under which both companies will jointly develop Gallium nitride (GaN) devices based on Panasonic’s normally-off (enhancement mode) GaN on silicon transistor structure integrated into Infineon’s surface-mounted device (SMD) packages. In this context Panasonic has provided Infineon with a license of its normally-off GaN transistor structure. This agreement will enable each company to manufacture high performing GaN devices. Customers will have the added advantage of having two possible sources for compatible packaged GaN power switches: a setup not available for any other GaN on silicon device so far.

Featuring silicon RFIC interoperability with Cadence’s Virtuoso, GoldenGate-in-ADS and a host of capabilities intended to increase design efficiency, the Keysight EEsof EDA software, ADS 2015, is changing how silicon RFIC and multi-technology module design is performed.

Silicon Labs, the leading provider of silicon TV tuners, introduced the sixth generation of its high-performance, field-proven TV tuner ICs. Silicon Labs’ new Si2151 and Si2141 TV tuners address the global hybrid TV and digital TV markets, support both digital and analog video broadcasts and comply with all worldwide terrestrial/cable TV standards. 

 Cree, Inc. has made seven new GaN HEMT die available through distribution via Mouser. Manufactured on silicon carbide (SiC) substrates using a either 0.4 or 0.25 μm gate length fabrication process, the gallium nitride (GaN) high electron mobility transistor (HEMT) die exhibit superior performance properties compared to silicon (Si) or gallium arsenide (GaAs) die, including: higher breakdown voltage, higher saturated electron drift velocity, higher thermal conductivity, and higher efficiency. 

MACOM announced an IP licensing program for Gallium Nitride (GaN) on silicon technology.  MACOM detailed recent progress in two areas critical to realizing its future vision of enabling the mainstream adoption of GaN as a large-scale RF semiconductor technology across the industry.

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.

Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.

Soitec (Euronext) and SunEdison Inc. announced that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products. The agreement provides each company with access to the other’s patent portfolio for SOI technologies and ends all outstanding legal disputes between the companies.