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Circuits on Al2O3, AlN, Si3N4 and BeO substrates are optimized for heat dissipation and power density. Thick-film Ag, Au, ENIG, ENEPIG and plated copper on thick film (PCTF), and Ni/Pd metallization form traces and spaces for high current and voltage.
Our substrate products include both traditional gold multilayer thick films with excellent wire bondability, solderability, and conductor adhesion, as well as lower-cost multilayer circuits.
Remtec Inc., a leading manufacturer of ceramic substrates, packages and submounts using PCTF (plated copper on thick film) metallization, has been acquired by Legacy Technlogies Inc. (LTI) , a major player in the field of precision glass-to-metal seals and glass-to-metal hermetic packages.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.
Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.
Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.
Remtec Inc. (Booth 3607) will be touting its recent technological advances at IMS 2011 in Baltimore. A leader in custom and semi-custom ceramic packaging based on Plated Copper on Thick Film (PCTF) technology, Remtch has reported an increase in sales of 62 percent for 2010. This growth has permitted...
Remtec Inc. , a manufacturer of metallized ceramic substrates and packages with Plated Copper on Thick Film Technology (PCTF®), and Microwave Packaging Technology Inc. (MPT), Anaheim, CA, a leader in the design, test and assembly of microwave modules and components, have announced a strategic alliance to integrate their core...
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has expanded its Direct Copper Bond (DBC) substrate capabilities. New capabilities includesolid copper filled vias and copper bore coated holes providing front-to-back connections and thermal paths for better heat management as well as solder mask and assembly options.
Remtec Inc., a leading manufacturer of substrates and packages using PCTF® (plated copper on thick and thin film) metallization, has applied its time-proven leadless ceramic SMT substrate technology to the development of a new line of standard SMT leadless packages for electro optical circuits matching standard TO-type window lids.