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ARTICLES

Remtec appoints William Dinardo new business development manager

Remtec Inc.
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Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.


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Remtec adds new ENEPIG universal finish

Remtec Inc.
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Remtec Inc. has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods. The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.


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Remtec Increases Sales, Adds New Technologies and Products

Remtec Inc.
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Remtec Inc. (Booth 3607) will be touting its recent technological advances at IMS 2011 in Baltimore. A leader in custom and semi-custom ceramic packaging based on Plated Copper on Thick Film (PCTF) technology, Remtch has reported an increase in sales of 62 percent for 2010. This growth has permitted...
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Remtec and Microwave Packaging Technology Form Strategic Alliance

Remtec Inc.
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Remtec Inc. , a manufacturer of metallized ceramic substrates and packages with Plated Copper on Thick Film Technology (PCTF®), and Microwave Packaging Technology Inc. (MPT), Anaheim, CA, a leader in the design, test and assembly of microwave modules and components, have announced a strategic alliance to integrate their core...
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