Circuits on Al2O3, AlN, Si3N4 and BeO substrates are optimized for heat dissipation and power density. Thick-film Ag, Au, ENIG, ENEPIG and plated copper on thick film (PCTF), Ni/Pd metallization form traces and spaces for high current and voltage. DBC, AMB and PTV® deliver exceptional thermal management. Controlled fine geometries, ground planes, multi-layer embedded structures ensure SWAP, 2.5D packaging, reliability, impedance control and low loss from DC through RF in demanding power electronics and microwave modules across wide operating ranges.
