Materials/Packages

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X2Y® technology is a new balanced component capable of high frequency performance across a broad frequency range. The component uses a standard ceramic capacitor with subtle, but important modifications to its structure. These structural changes create a circuit inside the capacitor that is capable of broadband electromagnetic interference (EMI)...

In the telecoms and other RF component markets, today's climate means that there can no longer be a trade-off between cost and performance - the designer needs to achieve both. Temex has recognized this fact and addressed it through the evolution of two new generations of materials on which...

A number of factors are driving the design of high speed digital packaging. At the assembly level, metal boxes are the dominant configuration due to mounting and interconnect constraints. The next assembly connectivity is accomplished through cables, requiring coaxial connectors. Since a variety of companies manufacture many of the...

The CMC-SOIC8 ceramic SOIC8 surface-mount package is ideal for packaging RF/microwave MMIC and discrete devices for applications from DC to 18 GHz. This new addition to CMC's standard product line is fabricated using aluminum nitride (AlN), a ceramic material with thermal conductivity of 180 W/m-K, about 10 times higher...

On December 13, 2002, we sent a questionnaire to 75 companies that provide products and services in this field, with a response deadline of January 11th. We used e-mail rather than the USPS so that we would have feedback that all the questionnaires were received. On January 3, 2003,...

In today's competitive environment designers and engineers are looking for any features that can give them the edge. When it comes to RF connectors, areas where that advantage can be gained are in the speed of installation, flexibility of connection and efficient utilization of space. The QuickLock family of...

When developing and producing complex RF connector housings, costs can be high and the process complex due to the sheer number of required machined metal components and the diversity of the necessary assembly. However, these difficulties can be overcome by employing molded injected metal (MIM) technology for connector manufacturing....

With all the talk about a wireless society, there is still a need for high performance coaxial cable assemblies. One of the areas still getting lots of development attention is cable assemblies for airborne electronic warfare. Most of these applications are at power levels too high for fiber optic...

As this article is written, it is estimated that 90 to 98 percent of first-level IC interconnects are made using wire bonding technologies. The remaining connections are primarily bump, or flip-chip connections. This ratio is expected to remain the same for the foreseeable future. In general, it will be...

The trend towards faster and higher frequency communications is driving the search for high reliability packaging solutions that satisfy ever more demanding performance requirements. However, when utilizing the packaging materials commonly available today, designers often come up against thermal, mechanical and/or cost barriers. To meet these demands, Osprey Metals,...