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ARTICLES

A Broadband Package Utilizing High Thermal Performance Aluminum Nitride

April 1, 2003
The CMC-SOIC8 ceramic SOIC8 surface-mount package is ideal for packaging RF/microwave MMIC and discrete devices for applications from DC to 18 GHz. This new addition to CMC's standard product line is fabricated using aluminum nitride (AlN), a ceramic material with thermal conductivity of 180 W/m-K, about 10 times higher...
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An Aluminum Nitride High Power Dissipation RF Packaging Platform

Introduction to a low cost, highly flexible aluminum nitride (AlN) high power dissipation platform utilizing co-fired AlN in a variety of configurations
October 1, 2001
Product Feature An Aluminum Nitride High Power Dissipation RF Packaging Platform CMC Wireless Components Phoenix, AZ Aluminum nitride (AlN) is an ideal electrically insulating material for use in high power electronic packaging applications. Possessing both high thermal conductivity and a non-toxic chemical nature, AlN is commercially available in a...
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