Articles Tagged with ''package''

Ampleon launched a series of LDMOS RF power transistors fabricated with its Gen9HV 50 V LDMOS process.

Smiths Microwave Subsystems  announced the release of the TRAK X-Band Surface Mount (SMT) Circulator. This device is a low-cost, true SMT circulator compatible with tape-and-reel (pick-and-place) and standard solder reflow profiles.

Ampleon announced the availability of a new package platform that will be rolled out across the entire LDMOS and GaN product portfolio. Over a dozen variants of the SOT502 and SOT539 platforms are in development.

RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.

SANTIER will be presenting their CTE matching high thermal conductivity metals and ceramic packages at IMS2015 in Phoenix, Ariz., May 17-22.

Freescale Semiconductor,  the global leader in radio frequency (RF) power transistors, introduced the industry’s highest power RF power transistors housed in plastic packaging.

 Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications. 

The LTC3624 is a high efficiency, 17V input capable synchronous buck regulator from Linear Technology that delivers up to 2A of continuous output current to outputs as low as 0.6V. Synchronous rectification delivers efficiencies as high as 95% while Burst Mode® operation requires only 3.5µA of no load quiescent current.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new 0.7 to 2.7 GHz, 10 W hybrid coupler from Wavelex.

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.