Semiconductors/RFICs/MMICs

T1G2028536 GaN Transistor

T1G2028536RFMW Ltd. announces design and sales support for TriQuint’s T1G2028536, a 285 W GaN transistor available in a low thermal resistance, solder mount package as the T1G2028536–FS or flange mount package as the T1G2028536–FL. Both the –FS and -FL house the transistor in a ceramic NI-780 enclosure.


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SKY85702-11 Front-End Module

SKY85702-11Skyworks Solutions Inc. introduces a highly integrated 5 GHz WLAN front-end module for reference designs targeting smartphones and tablets in a 2.5 x 2.5 mm, QFN package.  The SKY85702-11 incorporates a power amplifier and a SPDT transmit and receive switch for mobile/portable 802.11ac applications and systems.


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Four 650 V SiC Schottky Diodes

Microsemi Sic Schottky PR PhotoRichardson RFPD Inc. announces availability and full design support capabilities for four new 650 V Silicon Carbide (SiC) Schottky diodes from Microsemi Corporation (Microsemi). The new devices are the latest addition to Microsemi's SiC Schottky product family and feature zero recovery time (trr), low forward voltage and low leakage current.  They are available in compact footprint packages.


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LT3086 - LDO+™ Family of Linear Regulators

LT3086Linear Technology Corp.  announces the LT3086, the latest addition to the LDO+™ family, offering significant functionality previously unavailable in linear regulators. The 40 V, 2.1 A low dropout linear regulator (LDO) includes current monitoring with externally settable current limit and temperature monitoring with external control of thermal limit temperature.


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Micron-Scale Flexible Circuits

ERMF_PR

Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announces the capability to develop micron-scale flexible circuits for medical sensor applications, including various in-body and fluid sensors.


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10A Step-Down µModule®: LTM4633

4633Linear Technology has launched the LTM4633, a triple output 10A step-down µModule® (micromodule) regulator in a 15 x 15 x 5.01 mm BGA package with integrated heat sink for enhanced heat dissipation. Combined with bypass capacitors and three resistors, the LTM4633 solution fits within 4.5 cm² on a dual-sided PCB.


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