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th-Generation Wireless Systems (5G), says the optimist, will revolutionize our life as the 3G/4G systems did. While the majority are still waiting to link to the 4G network, the top telecoms have started the war for the next generation of mobile communication. 5G is expected to finally bring the autonomous car, VR and internet of things to reality and make science fiction come true.
Unwanted levels of PIM can result from several different factors, including the amplitudes and frequencies of the multiple transmitted tones, the configuration of a circuit’s transmission lines, and the current density and power level of the application. Multiple signal tones are usually denoted by their fundamental frequencies, such as f1 and f2, with the frequencies of their PIM spurious signals resulting from the differences between different harmonics of the fundamental tones. Learn about how PCB designs can reduce PIM.
I had the opportunity to speak at the IEEE sponsored 5G World Forum last week in Santa Clara. My talk focused on areas of research not necessarily related to the current 5G specification or 3GPP Release 15. The purpose of my presentation was not to rehash 5G, but to instead highlight areas that will help 5G reach its potential.
I recently covered how cloud services are helping accelerate design services with virtual CAE, and now we have seen an announcement from GradientOne about accelerating hardware utilization and providing insights into test data using their cloud platform.
OnScale is a leader in Cloud computer aided engineering (CAE), running multi-physics solvers on its Cloud HPC platform running on Amazon Web Servers. Their platform helps engineers to accelerate innovation for next-generation products such as 5G smartphones, IoT, biomedical devices and driverless car products by greatly reducing the solving time with massive computing power and using optimized algorithms.
This week two separate news items, one from Tektronix/IEMN and the other from Nippon Telegraph and Telephone Corporation (NTT), both announced development of 100 Gbps “wireless fiber” solutions. Each took a different route with Tektronix and IEMN (a French research laboratory) demonstrating a single carrier wireless link with a 100 Gbps data rate signal at 252 to 325 GHz per the recently published IEEE 802.15.3d standard while NTT used a new principle, Orbital Angular Momentum (OAM) multiplexing at 28 GHz with MIMO technology.
Researchers at Qatar University, University of Idaho and Temple University, led by Dr. Heena Rathore, are mimicking how the human brain works to prevent low-power IoT devices, such as insulin pumps, brain simulators, cardiac defibrillators and others, used in medical applications from being hacked.
Selecting a circuit board material for an application often comes down to a choice based on which has better specifications on the data sheet. Two different PCB materials from different suppliers might look identical in terms of key specifications, such as dielectric constant (Dk) and dissipation factor (Df), making a choice difficult. But how close are those two materials really? When can the data sheets look the same but the two materials be quite different?
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