Blog Posting

Hybrid Multilayer PCBs Help Keep Vehicles Safe

Advanced automotive electronics systems have relied on the reflections from on-board vehicular radar systems for some time. The vehicular radars are often fabricated on what are known as hybrid multilayer PCBs. These are PCBs formed of different kinds of circuit-board materials, matching the characteristics of the different materials to the needs of the different circuit functions, from DC through 77 GHz. Learn about designing with these new layers to realize better performing circuits at a lower cost.

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Satellite 2018 Review - Snowed In!

I was suppose to fly down to DC on Tues  to spend a couple of days catching up on the newest trends and products at Satellite 2018. But the Nor'easter dumped 2 feet of snow on Boston and every flight I could find was cancelled. So I remotely monitored the happenings at the event and collected the following materials from press releases and emails about what was on display for RF/microwave products.

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Don’t underestimate 5G and IoT rollout

Lessons learned from MWC 2018

Mobile World Congress solidified that 5G is fast approaching with deployments this year. In the US, Verizon is rolling out 5G millimeter wave Fixed Wireless Access in many cities and AT&T is rolling out 5G mobile service. T-Mobile will not be far behind with their dual band 600 MHz and 28 GHz 5G rollout starting Q2 of next year.

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802.11ax Going Live

With all of the focus on 5G these days, we tend to forget about Wi-Fi which actually carries the bulk of mobile traffic relatively effortlessly. That is not typically the case at events where there are hundreds or thousands of people using their mobile devices in a confined area. But the upcoming generation of Wi-Fi, 802.11ax, will change those poor service experiences into noticeable better ones.

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The Global Spectrum Challenge for 5G

Now that there’s an initial draft of the 5G spec (aka 3GPP Release 15), the world’s wireless leaders have achieved a big milestone. However, widespread 5G deployment still faces many challenges. One such challenge is that of global spectrum coverage or more specifically harmonized global spectrum coverage.

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Making the Most of PCB Materials for 5G Microwave and mmWave Amps

5G may represent the latest and greatest in wireless technology, but it will be challenging to design and fabricate, starting with the circuit-board materials, because it will operate across many different frequencies, such as 6 GHz and below as well as at millimeter-wave frequencies (typically 30 GHz and above); it will also combine network access from terrestrial base stations and orbiting satellites. But by careful consideration of mechanical and electrical requirements, high-frequency circuit materials can be specified that enable the design and development of 5G PAs no matter the frequency.

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