Welcome to Microwave Journal's Online Show Daily coverage of the IEEE MTT-S International Microwave Symposium 2024 in Washington, DC, 16-21 June. Our coverage includes exclusive content from conference organizers, exhibitors, the latest product releases, social media, May show issue technical articles and analysis from our editors.

May 2024 Show Issue Feature Articles

Full-Vehicle OTA Testing at the Core of the Connected Car (R)EVOLUTION

IMS2024 General Chairs’ Welcome

RFIC’24 Overview

2024 Spring/Summer ARFTG Microwave Measurement Conference

The IMS2024 Exhibition 


IMS2024 Exhibition

IMS Product Showcase


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IMSExecutiveForum.pngIMS Executive Forum: A&D Semiconductor to Systems Trends

Tuesday, 18 June 202416:00-17:00MicroApps Theater, Booth 2159

This panel of RF/microwave device and system company executives will discuss current trends in semiconductor technology and how they affect system design and performance. New types of compound semiconductor technology, AI integration, heterogeneous integration, chiplets, 3D packaging, new thermal materials and other related topics will be discussed including how these advancements affect system architecture and improve SWaP-C.

Moderator: Sanjay Raman, Dean of Engineering, University of Massachusetts Amherst

Panelists: Nick Kolias, Principal Engineering Fellow, Raytheon

Tim Lee, Technical Fellow, Boeing

Bryan Goldstein, President, Analog Devices Federal, Vice President, Aerospace and Defense Group, Analog Devices

Tom Kole, Vice President of Sales and Marketing, Integra Technologies

Dean White, Director- Defense and Aerospace Market Strategy, Qorvo

Sponsored By:

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IMS2024 Industry News


More IMS2024 News and Articles


Video

Microwave Journal editors Pat Hindle and Eric Higham cover the May IMS & 5G/6G themed issue including a groundbreaking article on Waste Factor, interview covering CATV with Mini-Circuits, industry news and IMS 2024 preview.

Podcast