Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. This epoxy system forms high physical strength bonds and can be utilized for bonding, sealing, coating and potting.
Featuring a silver coated nickel filler, MB600SCN is an aqueous based, sodium silicate system for use in applications where very good shielding effectiveness is required and cost considerations might be more pronounced. Conductive coatings are often applied to housings in order to protect electronic devices from EMI and RFI.
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. EP13LTE cures readily in 1-2 hours at 300 to 350°F. This epoxy paste has limited flow while curing. It bonds well to many substrates such as metals, glass, composites, ceramics and plastics.
Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350 to 700 cps. This low shrinkage/low exotherm product is particularly well suited for large volume casting applications as well as bonding, coating and sealing. EP29LPHE has a forgiving 100 to 80 mix ratio by weight and has an exceptionally long working life of 12 to 24 hours at room temperature for a 100 gram batch. It will cure at room temperature or more rapidly at elevated temperatures.
Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator.
Well suited for die attach applications, Supreme 3HTND-2DA is a single component fast setting epoxy that doesn’t require mixing or freezing. This toughened system has high die shear strength, superior electrical insulation properties, low ionics, an ideal dispensing profile (no tailing or bleed out) and performs well in 85/85 testing. It also passes NASA low outgassing tests.
One component Master Bond MasterSil 711 is a room temperature curing silicone compound for bonding, sealing, coatings and formed-in-place gaskets. It offers superior shock and impact resistance making it ideal for delicate electronic components. Flexible bonds are formed when exposed to atmospheric moisture. MasterSil 711 requires no mixing or heat, and sets within 2-3 minutes.
Master Bond’s epoxy EP79FL is a silver coated nickel filled polymer system that forms high strength bonds even at extreme cryogenic temperatures. It is electrically conductive and has minimal sagging while maintaining thermal cycling resistance. EP79FL is a strong and flexible system with exceptional chemical resistance properties. The electronic, electric, computer, semiconductor, microwave, appliance and automotive industries use it extensively.