MMICs&More

Challenging the Status Quo

The RF/microwave semiconductor market is poised to undergo some major shifts in the not too distant future with recent news of mergers between leading GaAs-based integrated device manufacturers, RFMD and TriQuint, CMOS-based RF front-ends for multi-mode, multi-band mobile devices from Peregrine and Qualcomm and the continued success in commercializing GaN by a number of vendors.  As GaN and CMOS semiconductor processes continue to improve performance and reduce costs, market share will undoubtedly shift between players.


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MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON

M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.


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MEI Wet Bench Automates Wafer Fab

RFIC

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.


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