Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Stackpole'sRAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance.
The new RAVS series from Stackpole offers stable reliable performance in a wide variety of environments including those with high amounts of sulfur. Stackpole’s proprietary process and materials with reduced silver yield a chip resistor array with excellent long-term reliability under conditions where standard chip resistors fail. The RAVS series shows typical resistance shifts less than 0.1 percent after 240 hours at 40C, 95 percent R.H., 5 volt bias, and H2S concentration of 3 ppm or greater.
The CSRF series from Stackpole is a foil on ceramic carrier technology that can achieve lower resistance values than thick film technology and offers excellent TCR of as low as 50 ppm. The CSRF0805 is rated at 0.5 W and is available in resistance values from 10 up to 100 milliohms, in 1 and 5 percent tolerances.