MMICs&More

Infineon Kicks Off Smart Power Fab in Dresden, Completion Planned for 2026

Thu, 16 Feb 2023 08:53:57 -0500

Infineon Technologies AG is starting construction of its new plant for analog/mixed-signal technologies and power semiconductors in Dresden.

Challenging the Status Quo

Thu, 24 Apr 2014 00:00:00 -0400

The RF/microwave semiconductor market is poised to undergo some major shifts in the not too distant future with recent news of mergers between leading GaAs-based integrated device manufacturers, RFMD and TriQuint, CMOS-based RF front-ends for multi-mode, multi-band mobile devices from Peregrine and Qualcomm and the continued success in commercializing GaN by a number of vendors. As GaN and CMOS semiconductor processes continue to improve performance and reduce costs, market share will undoubtedly shift between players.

MACOM to showcase highly integrated, plastic-packaged GaN solutions at EDI CON

Thu, 27 Feb 2014 13:27:00 -0500

M/A-COM Technology Solutions Inc.(“MACOM”), a leading supplier of high-performance RF, microwave and millimeter wave products, announced that it will showcase its industry-leading portfolio of new GaN power products at EDI CON 2014 in Beijing, China, April 8-10, 2014. The company will particpate in the event as an exhibitor in Booth #612 and in the conference as a presenter in the peer-reviewed technical session, workshops and special GaN expert panel to be sponsored by Richardson RFPD.

MEI Wet Bench Automates Wafer Fab

Wed, 15 May 2013 11:19:00 -0400

MEI was at CS Man Tech the week of May 13th to demo the company's high-quality semiconductor and batch immersion process tools that perform. All MEI’s semiconductor equipment are custom tailored to specific semiconductor processes and chemistry.

UMS appoints Link Microtek as rep for III-V MMICs and foundry services

Fri, 05 Apr 2013 00:00:00 -0400

Link Microtek has been appointed as a representative for United Monolithic Semiconductors in the UK and Ireland.

KRYTAR announces expansion of compact, ultra-broadband directional couplers

Thu, 24 Jan 2013 12:15:00 -0500

KRYTAR Inc. announces the addition of two new models offering 10 dB nominal coupling over the ultra-broadband frequency range of 2 to 40 GHz, each in a single, compact and lightweight package.

Richardson RFPD introduces 35 W, 32 V GaN on SiC RF power transistors from TriQuint

Wed, 16 Jan 2013 10:50:00 -0500

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a pair of 35W Gallium Nitride (GaN) radio frequency power transistors from TriQuint Semiconductor Inc. (TriQuint).

Stackpole's precision thin film resistor arrays offer tolerances down to 0.1%

Thu, 10 Jan 2013 10:08:00 -0500

Stackpole's RAVN Series is a thin film based chip array designed for applications with tight tolerance or tight TCR requirements. The Series offers four resistive elements in a 1.6 x 3.2 mm package with resistance values from 100 Ω up to 33 K Ω in a 0.1 percent tolerance.

Mini-Circuits introduces 75 Ω amplifiers for CATV, FTTx, MoCA and satellite systems

Wed, 02 Jan 2013 11:28:00 -0500

Mini-Circuits' new PGA-106 series of amplifiers deliver a winning combination of high dynamic range, low noise, and flat gain, fine-tuned to meet specific customer demands across a wide range of 75 Ω systems.

CarlisleIT launches SMP-L push-on connector series with Secure-Lok

Wed, 26 Dec 2012 11:04:00 -0500

CarlisleIT announced its new family of push-on connectors that incorporates a patent pending locking mechanism. The locking feature adds a strong retention force to the standard push-on connector which makes it ideal for rugged military and commercial applications susceptible to vibration.

Custom MMIC's new amplifiers offer high output power and positive bias

Thu, 20 Dec 2012 09:56:00 -0500

Custom MMIC added three new GaAs MMIC power amplifiers covering 5 to 11 GHz to their growing standard product library. The CMD169P4 (5 to 7 GHz), CMD170P4 (7.5 to 9 GHz) and CMD171P4 (9.5 to 11 GHz) each have an output 1 dB compression point of greater than +28 dBm, with gain levels from 20 to 30 dB.

Maxim Integrated introduces smallest bipolar, Beyond-the-Rails ADCs

Wed, 12 Dec 2012 16:45:00 -0500

Maxim Integrated Products Inc. announced it is now shipping the MAX11166 and MAX11167, the industry's smallest bipolar ±5 V, 16-bit analog-to-digital converters (ADCs), available in a tiny 9 mm² package.

CML Microcircuits releases a digital PMR chipset for low-power radio

Fri, 07 Dec 2012 15:10:00 -0500

CML Microcircuits has released new function images for their successful CMX7131/7141 family of digital PMR processors.

GPS/GNSS IC market on course to break $2 B in 2012

Fri, 30 Nov 2012 10:25:00 -0500

The GNSS IC market is showing steady revenue growth in 2012, with the industry now setting its sights on the next major milestone: $3 Billion.

Samsung Galaxy Appeal indicates shift from GaAS to CMOS PAs

Mon, 26 Nov 2012 11:35:00 -0500

The Samsung Galaxy Appeal is one of the first mass produced phones to ship with a high performance 3G CMOS power amplifier (PA). Despite an historical presence from CMOSin the 2G handset market concerns over performance have severely limited its progress in the 3G domain.

Vishay releases new 36 W battery shunt resistor with molded enclosure

Mon, 26 Nov 2012 09:16:32 -0500

Vishay Intertechnology Inc. announced a new Power Metal Strip® battery shunt resistor featuring a molded enclosure with a four-pin connector. Providing easy PCB connection to the shunt resistor assembly, the WSBM8518 allows design engineers to focus on circuit development instead of PCB connection issues.

FMC simplifies JESD204B-compatible data converter-to-FPGA connectivity

Tue, 13 Nov 2012 10:57:00 -0500

Analog Devices Inc. introduced an FPGA mezzanine card (FMC) that incorporates JEDEC JESD204B SerDes (serializer/de-serializer) technology to allow digital and analog designers to simplify high-speed data converter-to-FPGA connectivity.

MWC 2012: For mobile front-end RFICs - size and efficiency matter

Wed, 14 Mar 2012 20:25:00 -0400

Leading RFIC front-end device manufacturers were on hand at the2012 Mobile World Congress, showing off the latest chip sets. To achieve smaller footprints and deliver on higher power added efficiency, vendors are offering different solutions which could shake up the industry.

Hittite launches new SPDT switch and 5-bit MMIC attenuators

Mon, 06 Feb 2012 09:51:00 -0500

Hittite Microwave Corp. has introduced a new single pole double throw (SPDT) switch and two new serial controlled 5-bit digital attenuator MMICs, which are ideal for automotive, microwave radio, test equipment, military and space applications up to 50 GHz.

Samsung selects Javelin's CMOS 3G power amplifier

Tue, 31 Jan 2012 16:24:00 -0500

Javelin Semiconductor Inc., innovator of the world’s first high-performance CMOS 3G power amplifier (PA), announced that Samsung Electronics Co. Ltd. has selected Javelin’s JAV5501 Band I PA for new Galaxy smartphones.

Avago introduces PA for LTE cellular infrastructure equipment

Wed, 18 Jan 2012 12:58:00 -0500

Avago Technologies, a supplier of analog interface components for communications, industrial and consumer applications, announced a high-gain, high-linearity power amplifier for high-data-rate applications found in 700 to 800 MHz cellular infrastructure equipment.

TriQuint advances DARPA GaN R&D program ahead of schedule

Wed, 11 Jan 2012 13:17:00 -0500

TriQuint Semiconductor Inc. announced that it has begun work on Phase II of the Defense Advanced Research Projects Agency (DARPA) multi-year Nitride Electronic NeXt-Generation Technology (NEXT) program as a prime contractor.