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Materials/Packages

ARMMS is Full as Conference Evolves

The April ARMMS RF and Microwave Society conference , sponsored by Plextek and held at Milton Hill House, near Oxford, UK, was particularly significant — for the introduction of a new panel session and also for the fact that for the first time it was oversubscribed, with all of...
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Park Acquires Aircraft Composite Structures Business

Park Electrochemical Corp. announced that its new wholly owned subsidiary, Park Aerospace Structures Corp. , has purchased substantially all the assets and business of Nova Composites Inc. located in Lynnwood, WA. Nova Composites designs and manufactures aircraft composite structures and the tooling for such structures. These composite structures are...
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Park Announces Name Change of CT Business Unit

Park Electrochemical Corp. announced that it has changed the name of its business unit and subsidiary located in Waterbury, CT from Nelcote Inc. to Park Advanced Composite Materials Inc. This business unit will continue to manufacture advanced composite materials (the Nelcote® product line) principally for the aerospace markets. The...
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Namics and Diemat Announce Merger

Namics Corp. and Diemat Inc. announced the completion of a merger agreement to combine each company‘s services and products to better serve the global electronics marketplace. The agreement provides new opportunities for customers to benefit from expanded capabilities, complimentary technologies and expanded product lines. Diemat, founded in 1988, will...
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HumiSeal Signs Southern African Distribution Agreement

HumiSeal ®, the leading conformal coatings solutions provider for the protection of printed circuit boards and electronic assemblies, has signed an agreement with South African-based distributor PEM Technologies to distribute its range of conformal coatings throughout Southern Africa. Based in Gauteng, PEM Technologies has established a good reputation within...
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New Interconnect Technology Addresses System Integration

David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.
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