Materials/Packages

New Interconnect Technology Addresses System Integration

David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.
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Executive Interview: David Sherrer, Rohm and Haas Electronics Materials



Executive
Interviews
February 2008

David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.


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Labtech Gets Green Light for ISO 14001 Reaccreditation

Labtech Microwave, one of the UK’s leading manufacturers of microwave solutions, has attained ISO 14001 reaccreditation, with the aim of continuously developing the company’s environmental working practices. ISO 14001 specifies the requirements for an organization’s environmental management system and applies to those aspects over which it has control and...
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Today's Spectrum Management Challenges

Brian DuPell, President of DLI, spoke with Microwave Journal editor David Vye about today’s spectrum management challenges, the RADAR market and the role of High-Q ceramic-based RF/mW components play in achieving the system performance required by today’s military and commercial applications.
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SUSS MicroTec Receives Multiple Orders from ASE

ASE Group , the world's largest provider of independent semiconductor manufacturing services in assembly and test, has placed significant multiple orders with SUSS MicroTec for its lithography production equipment. The first order packages were booked in October and November and included several production mask aligners and coat/bake/develop clusters for...
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STMicroelectronics Lays Foundations in China

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...
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Infineon Ships One Billionth RF Transceiver

Infineon Technologies , a supplier of communication ICs, has shipped its one billionth RF transceiver. For more than 15 years the company has supplied its communication ICs to all major companies in the mobile phone segment, including Nokia, Samsung, Motorola, Sony Ericsson and LG. It shipped more than 230...
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StratEdge Moves to New San Diego Facilities

StratEdge , a leader in the design and production of semiconductor packages for microwave, millimeter-wave and high speed digital devices, announced it has moved its headquarters to new, state-of-the-art facilities. Still located in San Diego, CA, the new site enables StratEdge to increase capabilities and space for package design,...
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