Materials/Packages

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Rogers Corp. will be highlighting a blend of proven and new materials solutions at the upcoming Defense Manufacturing Conference 2010 (DMC 2010), November 29-December 1, to be held at The Venetian, in Las Vegas, NV. Representatives from Rogers Advanced Circuit Materials (ACM) Division will be available at Booth #1001...

Rogers Corp. announced that it has signed an agreement with PolyWorks Corp. of North Smithfield, RI, to license PolyWorks’ technology for molding Rogers’ industry-leading high performance foam brand, PORON microcellular polyurethanes, into three-dimensional shapes. The agreement, finalized on November 2, 2010, stems from a multi-year joint development effort to...

ARC Technologies has revamped its website for smoother navigation and easier document download. The site – www.arc-tech.com – now features a fresh design and the addition of flash animation on its homepage. For customers looking for the latest information on ARC Technologies’ microwave absorber products and electrically tuned composite...

Endicott Interconnect Technologies Inc. (EI) announced that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as...

As the demand for thinner, larger and more expensive LCD displays continues to grow, designers and manufacturers face new challenges with these increasingly complex technologies. Rogers Corp. ’s newest offering - PORON® ShockSeal foams - are specifically engineered to meet the challenging cushioning, sealing and protection requirements that larger...

Impact protection has come a long way from the days of steel armor. New technologies that seem like science fiction will be showcased during the 7th International Conference of Safety and Protective Fabrics to be held on Tuesday, October 26th, at the Orange County Convention Center in Orlando, FL....