Materials/Packages

A High Efficiency, Low Cost Silicon Bipolar GSM Dual-band PA Module

Presentation of the design and measurement data for a PA module using silicon RF-IC bipolar chip technology on a simple ceramic substrate
Technical Feature A High Efficiency, Low Cost Silicon Bipolar GSM Dual-band PA Module T. Johansson, P. Lundin, J. Engvall and D. Uggla Ericsson Microelectronics AB Kista, Sweden U. Hagström Ericsson Microwave Systems AB Mölndal, Sweden As the wireless communication business continues to expand, there is great demand for reducing...
Read More

Dual Mode Broadband Hybrids: Theory and Experiment

Development of a theoretical approach to the control and optimization of the major parameters of side and top wall hybrid couplers
Technical Feature Dual Mode Broadband Hybrids: Theory and Experiment Alex D. Lapidus Microwave Communications Company International Inc. Valencia, CA A theoretical approach to both side and top wall (hybrid) couplers based on strong experimental work is developed. Broadband operation, related to dual mode propagation through the coupling section, is...
Read More

A Broadband Planar Isolator Using Coupled Microstrip Lines on a Magnetized Gyrotropic Substrate

Introduction to a new type of broadband isolator using nonreciprocal coupling between two microstrip lines fabricated on a magnetized gyrotropic substrate
Technical Feature A Broadband Planar Isolator Using Coupled Microstrip Lines on a Magnetized Gyrotropic Substrate A new type of broadband isolator, using coupled microstrip lines on a transversely magnetized gyrotropic substrate, is proposed in this article. The nonreciprocal coupling between two microstrip lines can be used to create an...
Read More

Aluminum Nitride vs. Beryllium Oxide for High Power Resistor Products

Extensive study on the use aluminum nitride as an alternative to beryllium oxide for high power resistor and termination applications
Technical Feature Aluminum Nitride vs. Beryllium Oxide for High Power Resistor Products Michael Kettner, Patrick Biebersmith, Nelson Roldan And Balram K. Sharma Florida RF Labs Inc. Stuart, FL For the past few decades, beryllium oxide (BeO) has been the main substrate material used for RF resistors and terminations for...
Read More

Planar EM Simulation of Multi-chip Modules and BGA Packages

Effect of planar electromagnetic simulators on multi-chip modules and ball grid array mounting techniques
Technical Feature Planar EM Simulation of Multi-chip Modules and BGA Packages Jim DeLap Agilent EEsof EDA Westlake Village, CA As electronics vendors and consumers demand smaller and lower cost products, manufacturers must find ways to increase levels of integration while maintaining product functionality. These higher levels of integration are...
Read More

Rigorous Analytical Expressions for Electromagnetic Parameters of Transmission Lines: Coupled Sliced Coaxial Cable

A set of accurate closed-form formulas for primary parameter matrices and even- and odd-mode impedances for coupled sliced coaxial cables
Technical Feature Rigorous Analytical Expressions for Electromagnetic Parameters of Transmission Lines: Coupled Sliced Coaxial Cable This article is a continuation of a previous article that appeared in Microwave Journal and is the first part in the development of accurate closed-form formulas for the primary parameters (inductance [L] and capacitance...
Read More

Coping with Hidden Spurious Harmonic Modes in the Design of Low Pass Corrugated Waveguide Filters

Proposed simulation scheme to predict the frequency band location and hidden spurious harmonic modes in low pass corrugated waveguide filters
Technical Note Coping with Hidden Spurious Harmonic Modes in the Design of Low Pass Corrugated Waveguide Filters Hidden spurious harmonic modes in corrugated waveguide filters are investigated from both theoretical and practical points of view. It has been found that multiple mode couplings occurring at more than one place...
Read More

An Aluminum Nitride High Power Dissipation RF Packaging Platform

Introduction to a low cost, highly flexible aluminum nitride (AlN) high power dissipation platform utilizing co-fired AlN in a variety of configurations
Product Feature An Aluminum Nitride High Power Dissipation RF Packaging Platform CMC Wireless Components Phoenix, AZ Aluminum nitride (AlN) is an ideal electrically insulating material for use in high power electronic packaging applications. Possessing both high thermal conductivity and a non-toxic chemical nature, AlN is commercially available in a...
Read More

A DC to 50 GHz and Beyond MMIC Carrier

Introduction to a novel interconnection structure for high performance and high volume DC to millimeter-wave chip carrier applications
Product Feature A DC to 50 GHz and Beyond MMIC Carrier HEI Broadband, HEI Inc. Victoria, MN With frequency spectrum demands at a premium many of today's wireless applications are moving higher and higher in frequency. Many of the systems now operate in the Ku and Ka frequency bands....
Read More

Design and Prototyping of a Transimpedance Front-end Amplifier for Dense Wavelength Division Multiplexing Circuits

Development of an optical power monitor for use in dense wavelength division multiplexing circuits using a logarithmic operational amplifier transimpedance front-end amplifier
Technical Note Design and Prototyping of a Transimpedance Front-end Amplifier for Dense Wavelength Division Multiplexing Circuits As part of the development of an optical power monitor for use in dense wavelength division multiplexing (DWDM) circuits, the effectiveness of a logarithmic operational amplifier transimpedance front-end amplifier was investigated, and the...
Read More