Materials/Packages

European Microwave Week 2010, Paris: Style and Substance

European Microwave Week 2010 Show Wrap-up

David Vye and Richard Mumford summarize their visit to EuMW 2010 in Paris covering the conferences and exhibition. They discuss in detail each of their visits to exhibitors as they spent most of their time on the show floor.

EuMW: Paris, Substance & Style,
Richard Mumford

EuMW: An American Perspective,
David Vye


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SCHOTT Introduces Scratch Resistant and Shatterproof Glass

With “SCHOTT LAS80”, the technology group SCHOTT has now expanded its family of lithium aluminosilicate glasses to include a high-potential product for the booming market for cover panels and touch panels for use in consumer and computer electronics. As an extremely thin, chemically strengthened cover glass, it gives the...
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Rogers to Highlight Practical Materials Solutions

Rogers Corp. will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2010 conference and expo (October 19-20, 2010, Gaylord Texan Resort & Convention Center, Dallas, TX). Representatives from Rogers Advanced Circuit Materials (ACM) Division will be present at Booth #104 to...
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Arlon Showcases New MultiClad HF Product

ARLON ’s new MultiClad™ HF is the next generation of halogen-free, low-loss thermoset and prepreg system for high-speed and high-frequency multilayer printed circuit boards. MultiClad HF is a thermally robust, high durability system with a high Tg (205° by DSC), low Z-direction expansion (1.2 percent from 50° to 260°C)...
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RJR Polymers Announces Advances in LCP QFN Packaging

RJR Polymers , a developer of high performance semiconductor packaging, announced that it has made significant advances in the development of a new generation of Liquid Crystal Polymer (LCP) QFN, air cavity packages that will support finer lead pitches, thinner lead frames and shorter wire bond lengths in a...
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