Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Rogers Corp.'s Power Electronics Solutions (PES) group plans a strong presence at the upcoming SPIE Photonics West Conference and Exhibition, set for February 13-18, 2016 in San Francisco’s famed Moscone Center.
Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.
Rogers Corp. will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs with plated finishes.
Rogers Corp. will be a major participant in the conference and product exhibition segments of Europe’s largest trade show devoted to RF/microwave technology and applications-- European Microwave Week 2015 (EuMW 2015).
The High Performance Foams Division of Rogers Corp. has officially changed its name to Elastomeric Material Solutions to better reflect the growing range of products and capabilities available to meet customer needs.
Rogers Corp., a global technology leader in the development of high performance printed circuit materials, announced that its division previously known as Advanced Circuit Materials is changing its name to Advanced Connectivity Solutions (ACS)
Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets