Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. RO4360G2 laminates have a tailored high Dk of 6.15 at 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets
Rogers Corp. unveiled its ULTRALAM® 3850HT liquid-crystal-polymer (LCP) laminates for simplified and improved construction of multilayer circuit boards at higher temperatures. With a melt temperature of +330°C, ULTRALAM 3850HT circuit materials are adhesiveless laminates that use LCP as the dielectric film to deliver high yields in single-layer and multilayer circuit constructions. These laminates are well suited for high-speed and high-frequency circuit applications.
Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at DesignCon January 28-29, 2015 at the Santa Clara Convention Center in Santa Clara, Calif.
Rogers Corp., a global leader in engineered materials solutions, announced it has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd., for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015.
Rogers’ rolled copper cladding options, including the RO3003™ high frequency circuit material, are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. RO3003 has excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GHz.
Rogers Corp.’s Advanced Circuit Materials Division launched ROG Mobile, a free mobile app for apple and android devices. The new app allows users to access Rogers’ calculators, including the popular MWI (Microwave Impedance) simulation tool, literature, technical papers and the ability to order samples, all while on the go with their smart phones and tablets.
Rogers Corp. will be showing some of its high-performance electronic printed-circuit-board (PCB) materials and offering advice on optimum ways to use them at the upcoming PCB West Exhibition (http://pcbwest.com), September 10, 2014, at the Santa Clara Convention Center, Santa Clara, Calif.
Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.