Rogers’ rolled copper cladding options, including the RO3003™ high frequency circuit material, are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. RO3003 has excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GHz.
Rogers Corp.’s Advanced Circuit Materials Division launched ROG Mobile, a free mobile app for apple and android devices. The new app allows users to access Rogers’ calculators, including the popular MWI (Microwave Impedance) simulation tool, literature, technical papers and the ability to order samples, all while on the go with their smart phones and tablets.
Rogers Corp. will be showing some of its high-performance electronic printed-circuit-board (PCB) materials and offering advice on optimum ways to use them at the upcoming PCB West Exhibition (http://pcbwest.com), September 10, 2014, at the Santa Clara Convention Center, Santa Clara, Calif.
Rogers Corp. and representatives of the company’s Advanced Circuit Materials division (ACM) will be present at the 2014 IEEE International Microwave Symposium (IMS) June 3-5 to help attendees learn more about Rogers' wide range of high frequency circuit materials.
Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.
Rogers Corp. will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.
Rogers Corp. advanced circuit materials division launched COOLSPAN® thermally & electrically conductive adhesive (TECA) film providing reliable high temperature performance. COOLSPAN TECA film is a thermosetting, epoxy based, silver filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins and RF module housings.
Rogers Corp. will be promoting its industry-leading printed circuit board (PCB) materials at the IPC APEX EXPO, being held March 25-27, 2014 at the Mandalay Bay Resort & Convention Center (Las Vegas, NV). The IPC APEX EXPO, with more than 400 exhibiting companies and thousands of attendees, is a leading industry event for professionals involved in PCB design and manufacturing and electronic assembly and test.
Rogers Corp. will be promoting its high performance printed-circuit-board (PCB) materials at the DesignCon® 2014 expo. The event is being held January 29-30, 2014 at the Santa Clara Convention Center (Santa Clara, CA). The DesignCon 2014 Expo provides practical solutions for semiconductor and electronic design engineers from more than 150 of the top suppliers in the electronic industry.