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Materials/Packages

Teledyne Microwave Solutions invests in Teledyne Labtech Presteigne facility

Teledyne Microwave Solutions has invested in the Teledyne Labtech facility at Presteigne, Wales, following the recent completion of the installation of the new Shadow Line processing equipment in support of increased production requirements.


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New web site strengthens Remtec's position as leader in providing ceramic packaging solutions

 Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications. 


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T-Tech Inc. & The Geek Group partner to provide PCB design/prototyping

T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.


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Indium Corp. VP of technology to present at ECTC

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida. 


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Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.


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Indium Corp. technology experts to present at PCIM Europe

Indium Corp. technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany


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North American debut of first ever hybrid milling/laser prototyping system by LPKF

Attendees of the 2014 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth #1108. LPKF has announced that they will be debuting the first ever hybrid milling/laser prototyping system, the ProtoMat D104. Also at the show will be a UV laser prototyping system, the ProtoLaser U3. The show will be hosted in Tampa, FL., June 3-5 at the Tampa Convention Center.


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Rogers Corp. releases video on innovation center opening

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.


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SemiGen's automated PCB assembly outsource handles VGAs and more

SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, provides high-quality, automated PCB assembly for high-mix, low- to medium-volume printed circuit boards.


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Agilent installs atomic force microscope at Cambridge Graphene Centre

Agilent Technologies announced the recent installation of an Agilent 5600LS atomic force microscope with scanning microwave microscopy at the Cambridge Graphene Centre (CGC), in the UK.


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