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Rockwell Collins announced that China Eastern Airlines has selected a comprehensive suite of its communication, navigation and surveillance avionics and SATCOM for 80 new aircraft, including 60 Airbus A320s and 20 Boeing 777s.

TE Connectivity (TE), a world leader in connectivity, now offers a full complement of high-performance circular connectors, including DEUTSCH connectors, to its portfolio of circular connectors serving nanominiature, microminiature and compact small form factor applications.

Comtech Telecommunications Corp. announced that its Santa Clara, California-based subsidiary, Comtech Xicom Technology, Inc., has been awarded a contract totaling $1.4 million from a major system integrator to supply rack-mount, high-power amplifiers ("HPAs"). The HPAs will be used in an expansion of a system that relays military satellite communications around the world and that is already using similar Comtech Xicom HPAs.

Coilcraft’s XAL1010 Series of high-temperature, shielded power inductors combines excellent current handling and exceptionally low DC resistance in a rugged, molded package.

Watch episode 6 (Feb 10, 2014) of the bi-weekly industry update video series, Frequency Matters. Editors David Vye and Pat Hindle host the show covering RF/microwave news, events and technical content. Catch up on the latest happenings in the industry.

ABI Research expects the market for in-building wireless equipment and deployments to grow to over $8 billion in 2019, up from a forecast $4.4 billion for 2014 representing a 14% compound annual growth rate (CAGR).

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced several new premium filters for next-generation smartphones and other mobile devices. The high-performance filters utilize the company’s advanced acoustic wave filtering technologies to address some of the industry’s toughest LTE interference problems.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new 0.2 to 1.0 GHz, N-connectorized low noise amplifier (LNA) from Wavelex.

Agilent Technologies Inc. announced that Nitronex, a GaAs labs company and leading producer of GaN-on-silicon RF power devices, has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP model extraction software and Advanced Design System (ADS) circuit and system simulator—both market-leading platforms in RF and microwave design.

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .