Industry News

Wavesat Closes $11.7 M Round of Funding

Wavesat Inc. , a supplier of broadband wireless semiconductor solutions, announced the company has secured its latest round of funding, raising $11.7 M CAD. Existing investors led by BDR Capital, BDC Capital and Multiple Capital participated in the round. Proceeds will be used to further strengthen the company’s leadership...
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Agilent EEsof EDA & RF SoP Co-design

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...
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Mentor Graphics EDA & RF SoP Co-Design

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...
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AWR EDA & RF SoP Co-design

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...
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The Optimist

Call me an optimist. Despite the current recession and concern about business prospects for at least the first half of 2009, I believe the microwave industry will persevere and become stronger. The proliferation of communication systems in our personal and professional lives gives me confidence that the demand for...
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