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Featured Stories

EDI CON USA Announces 2017 Conference Chairs

EDI CON USA 2017, an event that brings together engineers working on high-frequency analog and high-speed digital designs, will take place at the Hynes Convention Center, September 11-13 in Boston, Mass. The event management team announced this year’s conference chairs: Thomas Cameron, CTO for the Communications Business Unit at Analog Devices Inc. will serve as the chair for the high-frequency subject areas, and Istvan Novak, senior principal engineer at Oracle, will serve as the chair for the high-speed digital areas of the conference.


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Signal Integrity Journal Launches With Seven Industry Leading Sponsors

Signal Integrity Journal, a new sister publication to Microwave Journal covering signal integrity, power integrity and EMC/EMI related topics, has secured seven sponsors to start the new year. The Platinum Level sponsorships are sold out for 2017 with industry leaders Rohde & Schwarz, Anritsu, Mentor Graphics and CST filling the top sponsorship level. Joining them are Cadence and Samtec at the Gold Level and Passives Plus at the Silver Level.


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SmartMesh IP Wireless Mesh Networks Expand to Address IIoT Networks with Thousands of Nodes

Linear Technology’s SmartMesh IP™ wireless sensor network (WSN) product line has expanded to address the growing needs of industrial Internet of Things (IoT) applications. New capabilities include the SmartMesh® VManager™ networking software, which seamlessly increases the mesh network capacity to thousands of nodes.


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Frequency Matters, Jan. 13, 2017

Industry Update and CES 2017 Review

Episode 76Microwave Journal Editors Pat Hindle and Gary Lerude discuss the January Radar and Antenna themed issue featuring a low cost tile array AESA radar approach for civil and defense radar applications, plus coverage of the latest news and events.


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