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MACOM achieves breakthrough for RF Energy applications with 300 W plastic-packaged GaN transistor

300 W GaN AmpMACOM announced a 300 W GaN on Silicon rugged power transistor in cost effective plastic packaging optimized for use in commercial scale solid-state RF energy applications. Based on MACOM’s Gen4 GaN technology, the new MAGe-102425-300 delivers performance that exceeds LDMOS at an equivalent price profile at scaled volume production levels.


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EDI CON USA Announces 2016 Gold Sponsors for Event in Boston, MA

EDI CON USAEDI CON USA today announced the Gold Sponsors for its next event taking place September 20-22 at the Hynes Convention Center in Boston, Mass. These sponsors will be highlighted throughout the EDI CON USA 2016 conference and exhibition, which is specifically organized for engineers working on high-frequency analog and high-speed digital designs.  


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EDI CON China 2016 takes the Gold

Fourth year sets records for attendance and exhibitors

EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.


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