Items Tagged with 'density'

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500 W HPA 3U Chassis: Model 2175

Empower RF Systems released additional, industry leading power amplifier models that complement the frequency coverage and power level "footprint" of their next generation, high power PA product family. Model 2175, covering 80 to 1000 MHz and delivering 500 W of broadband output power in a 3U, air cooled chassis is now available and offering unrivaled size / power advantages.


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Advantech Wireless completes the delivery of new SapphireBlu™ series GaN modular SSPA/BUC

Advantech Wireless Inc., a privately-held Canadian corporation and manufacturer of satellite, RF equipment and microwave systems announced that it has successfully completed the delivery of the New SapphireBluTM Series 6.6kW X-Band Rackmount UltraLinearTM GaN SSPA/BUC, the ultimate solution for wide bandwidth, ultra high power satellite teleport uplinks.


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Remtec develops new, cost-effective gold tin plating technique

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.


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Cree adds four new GaN HEMTs for radar to Digi-Key portfolio

Cree has added four new gallium nitride (GaN) high electron mobility transistors (HEMTs) to its product portfolio at Digi-Key, the sole distributor for Cree RF components. Respectively based on Cree’s high power density 50V, 0.25μm and 0.4μm GaN on silicon carbide (SiC) foundry processes, the new X-Band and S-Band components exhibit high efficiency, high power gain, and wide bandwidth capabilities.


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