White Papers

Airstrip(TM) — an Innovative Transmission Line Technology in Support of Hi-Rel Space Qualified Packaging

Mechanical integration of microwave components often becomes the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, boards built, designs reverified, then mechanical engineers fit everything into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.


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How GaN is Changing the SATCOM RF Front-End

Solid-state technologies such as gallium nitride (GaN) are transforming satellite communications (satcom). GaN’s advantages of high RF power, low DC power consumption, high reliability and smaller size (which reduces system weight) are opening new markets and revolutionizing the RF front-end (RFFE) in existing satcom applications.


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