Articles Tagged with ''microwave''

EDI CON 2013 - High-frequency electronic design engineers converged for learning and networking opportunities in Beijing. The event drew in excess of 2,000 attendees including over 1,100 unique conference delegates, over 800 visitors and exhibitors and more than 30 members of the press.

Link Microtek, a specialist manufacturer and supplier of RF and microwave subsystems and components, has strengthened its engineering division with the appointment of Eddie Ahn as microwave design engineer.

Microwave Development Labs Inc. (www.mdllab.com), one of the leading suppliers of high-frequency rotary joints, castings, and waveguide components for satellite-communications (satcom) systems, will be joining a host of exhibitors at one of the largest major events for satcom system developers, the Satellite 2013 Conference & Exhibition. The Conference is scheduled for March 18-21, 2013 while the Exhibition, with more than 350 companies already registered, will run from March 19-21, 2013.

One of the leading suppliers of high-frequency rotary joints, castings, and waveguide components for satellite-communications (satcom) systems, Microwave Development Labs (www.mdllab.com), will be joining a host of exhibitors at one of the largest major events for satcom system developers, the Satellite 2013 Conference & Exhibition.

EDI CON 2013 (March 12-14, Beijing, China), the industry-driven event for RF, microwave and high speed digital electronic design organized by Microwave Journal and Horizon House has announced its line-up of speakers for the opening plenary session to be held on March 12th at the Beijing International Convention Center.

S2D Microwave Inc. offers broad band 0.5 to 20 GHz, high performance 3 Bit, 60 dB switched bit attenuator. S3-AS6055R520 is a high performance compact unit with low insertion loss, fast switching speed, low harmonic distortion, Three-bit attenuation control has TTL driver.

AWR Corp. has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office and Visual System Simulator, as well as AXIEM and Analyst.

Michael Casper, president and CEO of UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the company's existing patented UltraVia™ process. The CopperVia was first introduced at the June2012 IEEE MTT-S International Microwave Symposium/Exhibition inMontreal, Quebec, Canada.

EDI CON organizers have announced six new exhibitors for the show, which is taking place this March 12-14 in Beijing, China. Azimuth Systems, Microwave Vision Group, Times Microwave, Insulated Wire (IW), Southwest Microwave and Tower/Jazz join the list of exhibitors and speakers at this industry-driven high-frequency electronics event.

The EDI CON 2013 organizers announce that executives from China Mobile Research Institute (CMRI), ZTE and the Beijing Institute of Radio Metrology and Measurements (BIRMM) will take part in the plenary session of the opening day program, presenting their respective emphasis on the system requirements driving high-frequency electronic design trends in China.