StratEdge is providing contract assembly services for attaching GaN and other high frequency and high power devices onto CuMoCu (CMC) tabs.
To obtain the lowest thermal resistance interface, StratEdge uses a proprietary AuSn or AuSi eutectic to attach GaN or silicon die with a backside gold surface. This maximizes the power output a transistor or MMIC can achieve without degrading its reliability, particularly important for high power desity GaN devices.
StratEdge’s process uses a high volume automated system, with micron placement accuracy, and is located in a cleanroom. Solder preforms are matched to the die size to reduce the solder bond line thickness to less than 6 µm.
“Eutectic die attach is a highly controlled die attach process that provides void-free, high-reliability, high accuracy chip attachment,” said Casey Krawiec, the VP of global sales for StratEdge. “GaN on CMC is perfect for chip-on-board applications because organic boards cannot withstand the eutectic die attach temperature.”
StratEdge provides the custom CMC tabs and the die attach service. The mounted device can then be assembled into the next level assembly.
StratEdge will be exhibiting at the 2019 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS), being held at the Loews Vanderbilt Hotel in Nashville from November 3–6. StratEdge will be in booth 10.