StratEdge Corp. is expanding and its facilities and capabilities for packaging RF/microwave devices. The Assembly Services division covers the gamut of packaging capabilities, from manual to fully automatic, first article prototypes to hundreds of thousands of modules, DC to above 63 GHz.

StratEdge's new ISO 9001:2015 facility has a Class 1000 cleanroom with Class 100 work area for workstations performing sensitive operations. Assembly capabilities include equipment for high speed fine wire wedge and ribbon bonding and a bonder for eutectic AuSn attachment of devices, achieving bond line thickness less than 6 µm. StratEdge's proprietary eutectic die attach technology has been optimized for GaN devices, enabling low junction temperatures, increased device reliability and the highest output power.

StratEdge's capabilities comprise

  • Epoxy and eutectic die attach.
  • Conductive and non-conductive epoxies.
  • Automated AuSn die attach, developed for GaN and GaAs devices.
  • Automatic and manual wedge wire bonding.
  • Ribbon bonding.
  • Low profile wire bonds.
  • 50 Ω lines to reduce wire lengths.
  • Full packaging or chip-on-tab, where StratEdge provides the heat spreading tabs.

The Assembly Services division specializes in the assembly of RF and microwave components, including GaN and GaAs devices with high frequency passive and active components. Multiple component can be integrated into multi-chip modules, including power amplifiers, low noise amplifiers and mixed signal devices.

”Flexible equipment, skilled operators, and experienced applications engineers enable StratEdge to accommodate the numerous needs of our customers. Our new die attach system is the fastest and most reliable multiple die-type bonder on the market and the automated eutectic die attach vastly increases throughput. When chips are assembled inStratEdge's high frequency or high-power packages they will perform to their fullest potential." — Casey Krawiec, VP global sales for StratEdge