Items Tagged with 'package'

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CTS Electronic Components Inc. announces development of Model 148, oven controlled crystal oscillator (OCXO), which use the unique SC cut crystal technology to significantly reduce power consumption (0.23W at +25ºC) and allow for additional board space with its miniature-sized package.

Lark offers a full line of ultra-thin filters for commercial and military markets. Lark’s new ultra-thin package offers superior performance in less than 0.09” high package with low insertion loss and ultimate rejection levels of 60 dB while maintaining better than 1.5:1 VSWR. Units are lightweight and ruggedized for today’s AIR, SEA & LAND applications.

TI announced two new software packages for its KeyStone-based multicore system-on-chips (SoCs): a new production ready small cell Physical (PHY) software package and a transport software package for wireless and other network-oriented applications.

Linear Technology announces the LTC6090, a precision operational amplifier that operates on a supply voltage up to 140 V (or ±70 V). Its combination of rail-to-rail output, 3 pA (typical) input bias current, 1.6 mV maximum input offset voltage and 3.5 µVP-P low frequency noise delivers the precision required for high performance ATE, piezo driver, and DAC buffer applications.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for new package options on an RF power LDMOS transistor from Freescale Semiconductor Inc. (Freescale).

Avago Technologies, a supplier of analog interface components for communications, industrial and consumer applications, announced a high-gain, high-linearity power amplifier for high-data-rate applications found in 700 to 800 MHz cellular infrastructure equipment.