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Items Tagged with 'package'

ARTICLES

New web site strengthens Remtec's position as leader in providing ceramic packaging solutions

 Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications. 


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Linear Technology's Synchronous step-down regulator delivers 2A & requires only 3.5µA of quiescent current

The LTC3624 is a high efficiency, 17V input capable synchronous buck regulator from Linear Technology that delivers up to 2A of continuous output current to outputs as low as 0.6V. Synchronous rectification delivers efficiencies as high as 95% while Burst Mode® operation requires only 3.5µA of no load quiescent current.


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Sonnet introduces Blink, the first full-wave multi-solver suite for on-chip passive device modeling

Software/EDA

Sonnet Software Inc. introduces Blink™, the first multi-solver passive device modeling suite, now available for purchase. Blink operates entirely from within the Cadence® Virtuoso® environment and is used for the analysis of on-chip passive devices such as spiral inductors and MIM capacitors.


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Hermetically Sealable Air-Cavity HTCC QFN Packages

QFN-Packages

Barry Industries, an ISO9001:2008 certified, ITAR registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging introduces its line of hermetically sealable HTCC quad-flat-no-lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six sizes from 3 to 8 mm with standard JEDEC MO-220 footprints.


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