Items Tagged with 'fabrication'

Lenthor Engineering, a leading provider of flex and rigid-flex PWB solutions announces the opening of their new design, fabrication and assembly facility in Milpitas, Calif.

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures,announced it has achieved breakthrough performances on key competitive benchmarks in the fabrication of precision optical components.  

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.  

T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, announced that its wafer fabrication facility in Lowell, Massachusetts, has been accredited by the Department of Defense (DoD) as a Category 1A Trusted Foundry. This DoD accreditation distinguishes MACOM as a trusted manufacturer of integrated circuits (ICs) for classified and unclassified U.S. military and aerospace applications.

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.

Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).

Michael Casper, president & CEO of UltraSource Inc., an industry leader in delivering  thin film on ceramic microchip manufacturing solutions, is pleased to announce the formalized addition of a new fabrication processing note on the company's website under Capabilities/Solutions titled: Ultra-Thin Substrates -- “Thin is In! (And We Can Help)”.