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ARTICLES

Three-Dimensional Electroformed Micro-Structure Capability

Three-Dimensional Electroformed MicroMetrigraphics announced it has developed an advanced process for creating high aspect ratio three-dimensional microstructures. Precision electroforming can create three-dimensional, single or complex, multi-layer microstructures. Geometric options are unlimited. Electroformed structures can include micro nozzles, slits, micro screen, micro mesh, encoder disks, embossing tools, and more.


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Metrigraphics announces one-micron resolution photolithography service

Metrigraphics, a process development and manufacturing resource for ultra-miniature, passive circuits and structures, announced it is now routinely achieving one-micron resolution in the photolithography service. 


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One-Micron Resolution Photolithography Service

One-Micron Resolution Photolithography ServiceMetrigraphics today announced it is now routinely achieving one-micron resolution in their photolithography service. Metrigraphics can provide these services to customers looking to fabricate ultra-miniature rigid and flexible circuits, ultra-miniature electroformed structures, and high-precision optical devices such as rotary discs, encoders and reticles.


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Metrigraphics achieves industry-leading benchmarks in optical component fab

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures,announced it has achieved breakthrough performances on key competitive benchmarks in the fabrication of precision optical components.  


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Advanced Microcircuit Metallization Process

 

Metallization ServicesMetrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12” X 12” or 144 square inches.


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Substrate-Based Thin Film Circuits

ThinFilmCircuitsMetrigraphics has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues. Using these additive fabrication techniques, Metrigraphics can now manufacture circuits in high volume.


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Metrigraphics' additive process yields substrate-based thin film circuits

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.  


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Micron-Scale Flexible Circuits

 

Flexible MicrocircuitsMetrigraphics announced it has achieved large-scale production of micron-scale flexible circuits six or more layers high, with traces (circuit lines) as narrow as three microns (11.81 x 10-5 inches). The circuits are so flexible they can be wrapped around objects with diameters as small as a pencil. Products include single-layer flex, multi-layer flex, coils, sensor components, and electrodes (neuro-stimulation).


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Website Offers Sub-micron Scale Circuit Manufacturing and Electroforming Services

Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced today the launch of their new website which features their core manufacturing services for brands needing ultra-small, sub-micron scale electrical, mechanical and optical circuits and structures.


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Extreme Resolution Micro Flex Circuits

Extreme Resolution Micro Flex (ERMF) CircuitsMetrigraphics announces the capability to develop Extreme Resolution Micro Flex (ERMF) Circuits for medical sensor applications, including various in body and fluid sensors.  Using additive photolithographic processes, ERMF circuits can be manufactured with traces and spaces as small as 5µm. They can also be delivered in complex, high-resolution shapes and patterns.


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