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ARTICLES

Micro-flex and thin film circuits for antennas and MIL-COM apps on display by Metrigraphics at IMS

 As today's battlefield gets more and more tactical, critical communications have never been more important. And as radios and subsystems are being pushed to become smaller and even more ruggedized, it’s causing a chain reaction right down to the circuit level. Where once rigid and thick film technologies were primary go-to solutions, today's military communication applications are requiring antennas to be even more flexible, circuits to fit into tighter spaces, and signal integrity at higher frequencies to be perfect. And to add to that, today soldiers’ vital signs are as closely monitored as a radar screen — it’s easy to understand the push towards advanced circuitry is tasking traditional thinking. 


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Metrigraphics launches advanced 3D electroforming services

Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has launched advanced 3D electroforming services. These services are an ideal solution for OEMs looking to integrate complex multilevel structures manufactured at an almost atomic level of precision — and who also require high repeatability and high yield.


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Three-Dimensional Electroformed Micro-Structure Capability

Three-Dimensional Electroformed Micro-StructureMetrigraphics announced it has developed an advanced process for creating high aspect ratio three-dimensional microstructures. Precision electroforming can create three-dimensional, single or complex, multi-layer microstructures. Geometric options are unlimited. Electroformed structures can include micro nozzles, slits, micro screen, micro mesh, encoder disks, embossing tools, and more.


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One-Micron Resolution Photolithography Service

One-Micron Resolution Photolithography ServiceMetrigraphics announced it is now routinely achieving one-micron resolution in their photolithography service. Metrigraphics can provide these services to customers looking to fabricate ultra-miniature rigid and flexible circuits, ultra-miniature electroformed structures, and high-precision optical devices such as rotary discs, encoders and reticles. Image resolutions of one to two microns are achieved on substrates up to 12" x 12" (144 square inches) as well as linear patterns up to 85".


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Advanced Microcircuit Metallization Process

 

Metallization ServicesMetrigraphics announced it has developed an advanced process for applying metal layers to circuit substrates and to polyimide layers on multilayer circuits. The process works for both rigid and flexible circuits. Metallization layers can range in thickness from 10 microns to over 100 microns. Substrates can range up to 12" x 12" or 144 square inches.


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Substrate-Based Thin Film Circuits

ThinFilmCircuitsMetrigraphics has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues. Using these additive fabrication techniques, Metrigraphics can now manufacture circuits in high volume.


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Metrigraphics' additive process yields substrate-based thin film circuits

 Metrigraphics, a process development and manufacturing resource for ultra-miniature passive circuits and structures, announced it has developed new breakthroughs in processing substrate-based ultra-miniaturized circuits. The additive processes used are an alternative to traditional chemical etching, which causes circuit lines to slope, resulting in performance variations and yield issues.  


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