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ARTICLES

Ball Grid Arrays: A DC to 31.5 GHz Low Cost Packaging Solution for Microwave and mm-wave MMICs

A ball grid array surface-mount packaging technology for applications including packaging of GaAs MMICs
Ball Grid Arrays: A DC to 31.5 GHz Low Cost Packaging Solution for Microwave and mm-wave MMICs The VIA/PAK™ ball grid array (VBGA) surface-mount packaging technology for high frequency RF and mm-wave applications is described in this article. The package was developed for the frequency range from DC to...
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